Excellent I/O electrical performance and high density for use in Intel Omni-Path Architecture (OPA)
Support Intel OPA switch reference designs with 3-high capability
September 27, 2017
Harrisburg, PA – September 27, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, today announced its new zQSFP+ belly-to-belly cages and connector for Intel®Omni-Path Architecture (OPA) switch reference designs. These single high and belly-to-belly cages are designed to address the increasing need for higher density I/O ports, supporting high throughput silicon chips.
With the addition of these cages to their portfolio, TE is now able to supply a full solution for Intel’s® OPA fabric design. Use these cages in tandem with TE’s LGA 3647 sockets and ChipConnect internal faceplate-to-processor cable assemblies for Intel OPA reference designs.
In addition, TE’s zQSFP+ single high cage is now qualified for use on the Intel OPA NIC card reference designs.
For more information on zQSFP+ products, please click here.
TE Connectivity Ltd. is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS.