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Japan
Update

Technical Data

Background
Tin Plating at TE
Customer Information Package
"Backwards Compatibility of RoHS Compliant Products", ECN article, Nov 2005
Lead Free Components in Automotive Applications, presented at IPC/JEDEC 2003 conference
Lead free paper presented at IICIT, October 2001
Lead Free Manufacturing Paper
Solderability
Solder Joint Inspection Information for Lead Free Solder - IPC 610D
Solderability of Lead Free Electrodeposits in Tin/Lead Solder - (Backwards Compatibility) (503-1001)
IPC/JEDEC J-STD-002B Solderability Test Report (Tin/Lead and Lead Free Solder) (503-1)
IPC/JEDEC J-STD-002A Solderability Test Report (Dip & Look)
Presentation on solderability testing
BGA connectors using lead free
Hot Air Leveled Tin: Solderability and Some Related Properties
Whiskering
Tin Reflow for Tin Whisker Mitigation, Presented at 2010 CALCE Tin Whisker Conference
Tin Whisker Testing: Hot Air Leveled Tin and Electroplated-Reflowed Tin
An Electrical Characterization of Tin Whiskers, Presented at MRS Spring Meeting, April 2007
Bright Tin for Whisker Mitigated Electronics Applications, presented at IPC/JEDEC 11th Conf on Leadfree, Dec 2005
Tin Whisker Reliability Assessment by Monte Carlo Simulation (IPC/JEDEC 2005)
Tin Whisker Qualification Testing - Eye of the Needle Compliant Pin Products (503-1006)
Electrostatic Fields and Current Flow Impact on Whisker Growth (IEEE journal paper)
NEMI Tin Whisker Acceptance Test Requirements Document
NEMI Tin Whisker Update - Oct 2004
Presentation on our whisker tests and results (Updated)
Investigations of Zinc (Zn) Whiskers using FIB Technology Paper, presented at IPC/JEDEC 2004
Investigations of Zinc (Zn) Whiskers using FIB Technology Presentation
Durability/Friction
Presentation on Durability
Coefficient of Friction
Contact Resistance
Fretting Performance of Lead Free Surface Finishes (503-1002)
Presentation on contact resistance testing of lead free platings
Lubricant Stability after SMT Soldering
Press-fit Terminations
Toward Lead-Free Compliant Pin Connections, presented at the SMTA 2005 conference
Evaluation of Plated-Through-Hole Deformation in Lead-Free Press-Fit Connections (503-2 RevA)
Effects of Lead-Free Surface Finishes on Press-Fit Connections, presented at IPC 2003 conference
Friction Behavior of Press-Fit Applications: Test Apparatus and Methodology, presented at IEEE Holm 2003 conference
White paper on press-fit connectors (tin and tin-lead) used in lead free boards
Slide show presentation form of this white paper
Presentation on press-fit from ICEC 2002
Heat Resistance of Polymers
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance, presented at IPC/APEX 2004 conference
Presentation overviewing the impact of higher temperatures on the performance of plastics in connectors.
Resistance to Soldering Heat - Reflow: TE Spec. TEC-109-201
Resistance to Soldering Heat - Wave: TE Spec. 109-202
Wire Deformation
Insulation Displacement Connections for RoHS Compliance (503-1008)
Crimp Qualification Testing: USCAR-21
Crimp Qualification Testing: USCAR-20
Relays
Axicom lead free products site
Other Hazardous Materials
Design for Low-Halogen Green Electronics
Low Halogen Polymers for Electronic Applications
Case study in Hexavalent Chromate Replacement
General Hazardous Materials Concerns at TE
Hexavalent Chromium and Cadmium Overview