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Heat Sink Assemblies Overview


Heat Sinks
Heat Sink Assemblies

Chip Coolers provides unique cooling solutions for BGA semiconductor packages from 21mm to 49.5 mm.

Chip Coolers heatsinks use an exclusive clip for attachment to the BGA that allows for quick, clean and replaceable mounting. The clip attaches to the BGA semiconductor package using the patented CoolSnap method and does not add any additional height to the heatsink. The clip easily disassembles from the BGA eliminating difficult rework caused by adhesive attach TIM’s. The threaded heatsink base allows for quick installation or removal from the clip. All Chip Cooler heatsinks have TIM applied and are ready for assembly when received.

Tyco Electronics also offers heat sinks for XFP and SFP Pluggable Transceivers for networking, SAN and PCI applications. These are available in 3 industry standards:

  • SFP – Small Form Factor Platform
  • XFP – X Form Factor Platform
  • QSFP – Quad Small Factor Platform

    Key Features
  • BGA heatsinks assemble and disassembly easily, no adhesives are required
  • BGA heatsink is threaded and can be easily removed from the clip
  • BGA heatsinks are supplied with TIM material applied
  • Available for BGA sizes 21mm to 49.5mm
  • Pluggable transceiver heatsinks are available in SFP, XFP and QSFP industry standards
    Applications
  • Communications Equipment
  • Consumer Electronics
  • PC’s
  • Servers
  • Workstations
  • Business Equipment
  • Optical Transceivers

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