.050 centerline two row plug an receptacles designed for high density, high speed applications. Positions range from 40 to 240.
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AMPMODU 50/50 grid vertical headers and receptacles, right angle headers and double row cable connectors are designed for parallel board-to-board stacking in high density applications.
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The AMPMODU System 50 system is composed of one- and two-row receptacles and post headers on a .050 x .100 contact spacing used in board-to-board or cable-to-board applications.
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Pin and receptacle assemblies for MTE, MT and Tandem Spring product lines. Single or dual rows terminate to printed circuit boards or wire.
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AMPMODU Receptacles are single and double row, dual entry style connectors on a .100 centerline. Receptacles are available in thru hole or surface mount styles and can be hortizontal or vertical in configuration.
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AMPMODU stacking connectors are a two-piece interconnection system designed for parallel stacking printed circuit boards, without use of mother boards.
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Available with crimp, snap-in contacts or preloaded with right-angle posted contacts. The crimp type housing is unloaded, allowing the purchase of just enough contacts to meet circuit and retention requirements to reduce cost.
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A rugged, large scale system on a .156 centerline, designed for board-to-board, wire-to-board or cable applications and meets the requirements for most modular power supply packaging.
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A rugged, large scale system on a .200 centerline, designed for board-to-board, wire-to-board or cable applications and meets the requirements for most modular power supply packaging.
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.5mm Free Height connectors provide the capability of varying spacing between parallel pcbs from 4mm to 8mm, while providing a grounding circuit in the board mount receptacles at every 9 or 10 signal circuits.
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Board-to-board stacking connectors on a .6mm centerline with a highly reliable two-point contact design.
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Fine-pitch header and receptacle connectors with a two-point contact structure (floating unit and roll sides) ensures high contact reliability for tough factory environments. Stacking height: 30mm, 19mm, and 16.75mm. Current rating is 0.5 Amps.
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.8mm Free Height connectors are vertical board mount plugs and receptacles that are available in stacking heights ranging from 5mm to 20mm in 1mm increments.
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This surface mount parallel stacking connector features contacts on a 1.0mm pitch and is available in eight stacking heights from 8mm to 15mm in the IEEE 1386 standard 64-position version and an optional 84-position version.
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A self aligning connector with two-leaved tab contact construction enhances contact reliability and prevents mismounting of connectors due to bent posts for board-to-board applications. The plug assembly is available in top and bottom entry.
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Comprised of a PC board mount molded connector housing, preloaded with female contacts that mate with optional styles of male contacts to provide either board-to-board or wire-to-board interconnection.
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Versatile double-row connector system comprised of various straight and right angle post headers and several closed top-entry receptacle assmeblies for vertical and hortizontal mounting. They are ideal for mobile and portable personal computers and disk drive applications.
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Free-board and fixed-board headers and receptacles with a 2mm contact pitch Futurebus+ and Futurebus+ "like" applications. Connectors are available in signal, power and a combo of both.
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The AMPMODU two-piece printed circuit board connector family are 2-row and 3-row headers and receptacles that provide a short signal path for VLSI applications.
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A vertical Advanced Mezzanine Card (AMC) press-fit connector designed to the MicroTCA.0 specification.
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Plug and receptacle connectors available in .5mm pitch with stack heights of 4-6mm and in .8mm pitch with stack heights of 4.0 and 4.5mm.
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0.5/0.8mm Fine Stack board-to-board connectors are used in applications where small size and slim construction are vital, such as camcorders, LCD displays, and cellular telephones. These connectors enable high-density packaging with contacts on 0.5mm centerline and stack height of 1.5mm or with contacts of 0.8mm centerline and stack height of 3.0mm.
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A subminiature board-to-board connecting product that can alter the spacing of parallel boards between 4mm and 16mm.
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Available in vertical press-fit, straddle mount and right angle configurations to meet a variety of requirements. High current SEC-II connectors are ideal for use in high-end computers and data storage equipment, yet durable enough for industrial applications as well.
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ICCON connectors use ELCON CROWN BAND Contact, a multifingered spring which provides a greater surface contact area, thus ensuring small millivolt drop, minimum heat generation and very low insertion and extraction forces.
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Our Impact High Density Backplane connectors provide data rates up to 25 Gb/s with differential pair density of up to 80 pairs per linear inch. The low impedance, localized ground return path along with ground structures to isolate the pairs, reduce cross-talk and increasing overall performance.
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Two piece impedance controlled connector family available on .025 pitch and in 15 stack heights from 6.5mm to 32mm.
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.050 centerline connectors that terminate to printed circuit boards, wire or cable. The female part has an additional positioning spring which prevents movement giving a gas tight connection under all circumstances.
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Two row plug and receptacle connector with a micro-strip concept of two rows of signal contacts divided by a center power ground plane. Centerline is 0.5mm and .8mm and they are available in 40 thru 300 positions. Stack heights range from 5mm to 30mm.
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Board-to-board power interconnect solution configured to mate directly with a PC board edge or with a solid bus bar. True hot plug power, signal and mixed contact modules can be combined and mounted end-to-end to meet application requirements.
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MULTIGIG RT Series is a robust, scalable board to backplane connector with a high density ""pinless"" design providing high datarates and signal integrity. Modular components provide customization. The RT2 Series has been demonstrated to support 10 Gb/s.
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Connectors that are industry standard product offerings which comply with the interconnection requirements defined by the PC/104 organization (http://www.pc104.org)
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A grid array mezzanine connector desgined for high speed, high density applications up to 10+ Gb/s.
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The STRADA (which means 'road or path') MESA connectors were developed for next generation interconnect solutions whose contact design can be arranged for either high speed differential, high density single-ended and/or coax patterns. The power contacts have the capability to carry up to 10 Amp of current.
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Modular headers and receptacles with a current density up to 100 Amps per linear PCB inch. Designed to sequence with 2mm Hard Metric backplane connector systems as well as Z-PACK Stripline 100, AMP-HDI, TBC, TBC Plus, Eurocard and Multigig connectors.
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Z-PACK 2mm HM 4 & 4+1 row is a slim version of the HM 5 row standard connector. Designed specifically to fit into instrumentation applications with slot spacing as narrow as 15mm. Designed in accordance with IEC 917-2-2 and IEC 61076-4-101 specifications.
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Z-PACK HM-Zd connectors are high-speed, differential, board-to-backplane interconnects that operate at speeds up to 12 Gb/s.
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High density, high performance backplane interconnect system. Fully protected right-angle receptacle for use on daughtercards preventing damage when mating to a header. This connector permits field repairability at either the module or single pin levels.
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