The CHAMP 0.8mm High Density Interconnection System is designed for high density, low profile (5.0mm) shielded applications featuring two rows of contacts on 0.9mm centerlines. These connectors are designed to meet SCSI I/O and VHDCI applications.
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CHAMP .050 Series Connectors meet the needs for high density, .050 inch (1.27mm) contact centerlines, allowing the printed circuit board designer to maximize valuable PC board real estate without sacrificing interconnection capability.
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These standard CHAMP connectors are fully intermateable with existing connectors of a similar design. Applications include but are not limited to: all phases of Telecommunications, business & test equipment, computer terminals, and many others.
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