| Part |
Differing Features |

|
- Format = Micro Secure Digital Card
- Polarizing Post Length = .45 mm
- Lead Type = Surface Mount - Inline leads
- Operating Function = Push-On Push-Off
- Right Angle Mount Angle
|
- Mounting Style = Top (Printed Circuit Board)
- Gold Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
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|

|
- Format = Secure Digital Card
- Polarizing Post Length = .80 mm
- Lead Type = Surface Mount - Inline leads
- Operating Function = Push-On Push-Off
- Right Angle Mount Angle
|
- Mounting Style = Bottom (Printed Circuit Board)
- Gold Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
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|

|
- Format = Secure Digital Card
- Polarizing Post Length = 1.00 mm
- Lead Type = Thru Hole
- Operating Function = Push-On Push-Off
- Right Angle Mount Angle
|
- Mounting Style = Top (Printed Circuit Board)
- Gold Contact Plating, Mating Area, Material
- Packaging Method = Tray
- Tyco Electronics
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 260°C |
|
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|

|
- Format = Secure Digital Card
- Polarizing Post Length = .55 mm
- Lead Type = Surface Mount - Inline leads
- Operating Function = Push-On Push-Off
- Right Angle Mount Angle
|
- Mounting Style = Bottom (Printed Circuit Board)
- Gold Contact Plating, Mating Area, Material
- Packaging Method = 44mm Tape & Reel
- Tyco Electronics
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
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|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Header Type = Type II
|
- Lead Type = Surface Mount - Inline leads
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type II
- Lead Type = Surface Mount - Inline leads
|
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Tray
- With Vacuum Tape
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Lead Type = Surface Mount - Staggered leads
|
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = 72mm Tape & Reel
- Without Vacuum Tape
|
| 5 of 6 EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Lead Type = Surface Mount - Staggered leads
|
- Vertical Mount Angle
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tube
- With Vacuum Tape
- AMP
|
| 5 of 6 EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Lead Type = Surface Mount - Staggered leads
|
- Vertical Mount Angle
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
- With Vacuum Tape
- AMP
|
| 5 of 6 EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Lead Type = Surface Mount - Staggered leads
|
- Vertical Mount Angle
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tube
- With Vacuum Tape
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Lead Type = Surface Mount - Staggered leads
|
- Vertical Mount Angle
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tube
- With Vacuum Tape
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 10 Positions
- Format = Memory Stick
- Solder Tab Length = 1.2 mm
- Operating Function = Push-On Push-Off
- Right Angle Mount Angle
|
- Mounting Style = Top (Printed Circuit Board)
- Gold (5) Contact Plating, Mating Area, Material
- Packaging Method = Tray
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type II
- Lead Type = Surface Mount - Inline leads
|
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Tray
- Without Vacuum Tape
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Header Type = Type II
|
- Lead Type = Surface Mount - Inline leads
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Tray
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Format = Micro Secure Digital Card
- Polarizing Post Length = .45 mm
- Lead Type = Surface Mount - Inline leads
- Operating Function = Push-On Push-Off
- Right Angle Mount Angle
|
- Mounting Style = Top (Printed Circuit Board)
- Gold Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Lead Type = Surface Mount - Staggered leads
|
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = 72mm Tape & Reel
- Without Vacuum Tape
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Header Type = Type II
|
- Lead Type = Surface Mount - Staggered leads
- Vertical Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type II
- Lead Type = Surface Mount - Staggered leads
|
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = 72mm Tape & Reel
- Without Vacuum Tape
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type I
- Header Type = Type II
|
- Lead Type = Surface Mount - Staggered leads
- Vertical Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tube
|
| 5 of 6 EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 50 Positions
- Format = CompactFlash™
- CompactFlash™ Product Type = Header Only
- Header Type = Type II
- Lead Type = Surface Mount - Staggered leads
|
- Right Angle Mount Angle
- Mounting Style = Top (Printed Circuit Board)
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = 72mm Tape & Reel
- Without Vacuum Tape
|
| 5 of 6 EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|