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		<title>TE Connectivity Fiber Optics News</title>
		<link>http://www.te.com</link>
		<description>TE Connectivity Fiber Optics News Feed</description>


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			<title>Enhanced-Footprint CXP Interconnect Supports Total Bandwidth of 120 Gbps Through 12 Channels of 10 Gbps</title>
			<description>&lt;p&gt;HARRISBURG, Pa. -- Oct. 14, 2011 -- To support the latest high-speed InfiniBand CXP 12x QDR standard and IEEE 100 Gbps Ethernet specification, TE Connectivity has developed an enhanced-footprint CXP pluggable connector and cage in a convenient one-piece, press-fit assembly. This new product supports 12 channels of up to 10 Gbps data rates for a total bandwidth of 120 Gbps, offers improved electrical performance and supports pluggable copper or optical transceivers and active optical cable options.&lt;/p&gt;

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			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1922</link>
			<pubDate>Fri, 14 Oct 2011 00:00:00 GMT</pubDate>
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			<title>Connector Meets Requirements of Next-Gen Long Term Evolution (LTE) Fiber To The Antenna (FTTA) Designs</title>
			<description>&lt;p&gt;HARRISBURG, Pa. -- April 15, 2011 -- To meet the requirements of next-generation WiMax and Long Term Evolution (LTE) Fiber To The Antenna (FTTA) connectivity designs for rugged outdoor use, TE Connectivity (TE) has released the FullAXS connector system that provides the SFP connection between the remote radio and base station for telecommunications applications. This new product offering accommodates the broadest range of SFP transceivers in the market, allowing end-users to select the transceiver that meets their specific system requirements.&lt;/p&gt;

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			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1878</link>
			<pubDate>Fri, 15 Apr 2011 00:00:00 GMT</pubDate>
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			<title>TE Showcases Next-Generation Connectivity Products and Demonstrations at DesignCon 2011, Booth 515</title>
			<description>&lt;p&gt;HARRISBURG, Pa. -- Jan. 25, 2011 -- Tyco Electronics (TE) will exhibit its broad portfolio of connectivity products at DesignCon 2011, booth #515, February 1-2, at the Santa Clara Convention Center, Santa Clara, California. TEs theme for the event will be Shaping Intelligent Connectivity.&lt;/p&gt;

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			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1861</link>
			<pubDate>Wed, 26 Jan 2011 00:00:00 GMT</pubDate>
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