TE Connectivity Circuit Protection News

TE Circuit Protection's MHP Device Named Product of the Year by Electronic Products Magazine

Tue, 10 Jan 2012 00:00:00 GMT

MENLO PARK, Calif. -- January 10, 2012 -- TE Circuit Protection, a business unit of TE Connectivity, today announced it was honored with an Electronic Products 2011 Product of the Year award for its MHP30-36 product. The MHP (metal hybrid PPTC) device is an overcurrent protection device that combines a bimetal protector in parallel with a polymeric positive temperature coefficient (PPTC) element.

Low-Resistance, High-Current Reflowable Thermal Protection (RTP) Device

Tue, 18 Oct 2011 00:00:00 GMT

MENLO PARK, Calif. -- Oct. 18, 2011 -- TE Circuit Protection announces the RTP200R060SA device, the latest in the series of Reflowable Thermal Protection(RTP) devices that offer a convenient, cost-effective alternative to typical thermal fuses. RTP devices help protect against thermal-runaway damage caused by MOSFETS, capacitors, ICs, resistors and other power components that can crack and fail.

New Surface-Mount 2410 Fuses Provide High I²t Characteristics

Wed, 20 Jul 2011 00:00:00 GMT

MENLO PARK, Calif. -- July 14, 2011 -- TE Circuit Protection announces the 2410SFV family of 20 new AC/DC fuses featuring current ratings from 0.5A to 20.0A. The 2410 fuses help provide secondary-side circuit protection, conserve board space and reduce design costs in a broad array of high-voltage, high-current designs. Typical applications include home appliances (LCD TV LED backlighting, LCD TV CCFL backlighting) and LED lighting, as well as office automation, industrial and medical equipment.

TE Connectivity Plugs into Future of Smart Grid

Fri, 15 Jul 2011 00:00:00 GMT

The parking deck is capable of housing a number of charging stations including high-voltage, fast charging stations.

With a history of over 50 years in developing and manufacturing next-generation electronic components, TE Connectivity continues to be on the cusp of the latest advances in the technology revolution. As an associate member of the FREEDM Systems Center, TE actively participates in contributing to advancing the Center's research. The donation of the level II charging station will further the Center's mission to study and refine current Smart Grid technology.

Progressive: TE Connectivity Supports Project of the FREEDM Systems Center Research Institute

Thu, 14 Jul 2011 00:00:00 GMT

Focus is on investigating a wireless charging station for electric vehicles

Active research support
The goal of the joint research project with the FREEDM Systems Center is to develop solutions for the wireless charging of electric cars. Different scenarios are being studied, including the stationary charging of electric vehicles as well as in-motion transfer. The project team, which consists of scientists and industry representatives, identifies the various interfaces required for implementation and the components which need to be developed for this purpose. In this regard, TE personnel accompany and advise the research students, giving them the benefit of their experiences in the automotive industry. "The regular exchange between TE and the young scientists ensures that highly innovative ideas are translated into practical solutions," says Roger Thrush, Director of Engineering for Global Automotive at TE and one of the projects mentors. "The close interaction with the students in the research project is a major asset to both sides. Not only can TE provide experience from decades of practice; in return, the company receives much important input. All our employees will benefit from this transfer of knowledge. Therefore, two of our interns are also involved in the research project. With this investment, we can give them know-how that, in this form, is unique and very valuable for their career."

ChipSESD Protection Devices in Standard 0201 & 0402 Packages

Wed, 02 Feb 2011 00:00:00 GMT

MENLO PARK, CA -- Feb. 2, 2011 -- Tyco Electronics (TE) has announced the expansion of its silicon ESD (electrostatic discharge) protection product portfolio with the introduction of 0201- and 0402-size devices that are easier to install and rework than traditional semiconductor-packaged ESD devices. The ChipSESD package combines the advantages of an active silicon device with a traditional Surface-Mount Technology (SMT) passive packaging configuration.