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		<title>TE Connectivity Computer and Consumer Electronics News</title>
		<link>http://www.te.com</link>
		<description>TE Connectivity Computer and Consumer Electronics Product News Feed</description>


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			<title>Breakthrough 0.3mm Front Flip Lock FPC Connector</title>
			<description>&lt;p&gt;SHANGHAI, China -- Dec. 20, 2011 -- To optimize connectivity in miniaturizing electronic products, TE Connectivity today announced the release of the company's 0.3 mm front flip lock, Flexible Printed Circuit (FPC) connectors. This new product offering is low-halogen and includes connectors up to 71 positions. &lt;/p&gt;

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			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1934</link>
			<pubDate>Tue, 20 Dec 2011 00:00:00 GMT</pubDate>
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			<title>Optimized Scalable One-Piece Board-To-Board Connector Improves Design Flexibility</title>
			<description>SHANGHAI, China -- Dec. 13, 2011 -- TE Connectivity introduces a sleek one-piece compressive board-to-board (BtB) connector which enables connecting to a locally gold-plated secondary board by compression of the contacts. It is also scalable in number of positions, height and pitch which enhances design flexibility and has been adopted by major mobile device manufacturers.&lt;br /&gt;&lt;br /&gt;This compressive BtB connector, made of high- temperature thermal plastic and copper alloy, comes with dimples on the contact area anf features preloaded contacts that are protected from damage due to accidental contact lifting. The 0.08mm co-planarity over all solder tails further reduces solder paste thickness, allowing for greater accuracy and expanded applications. The products are packaged in embossed tape to allow for automatic pick and place operations. This BtB connector is optimized for automated assembly to reduce costs and lead time.&lt;br /&gt;&lt;br /&gt;With sleek design, scalability and optimization for</description>
					
			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1933</link>
			<pubDate>Tue, 13 Dec 2011 00:00:00 GMT</pubDate>
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			<title>Industrial USB Connectors Support Increasing Use Of USB Standard In Industrial Applications</title>
			<description>&lt;p&gt;NUREMBERG, Germany -- Nov. 21, 2011 -- TE Connectivity has expanded its portfolio of industrial USB 2.0 connectors to include latching and circular sealed USB connectors. The latching version adds retention force to USB connections and features a latching plug and receptacle with standard IP 20 protection. This USB connector adds 40 Newtons of locking strength with an integrated, positive latching mechanism and offers 1,500 mating and unmating cycles. The latching mechanism helps avoid downtime caused by accidental unplugging and an audible and tactile feedback confirms that the connector is fully engaged. Typical applications are in the mobile segment such as hand-held devices with a controller-to-peripheral interconnection.&lt;/p&gt;</description>
					
			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1930</link>
			<pubDate>Tue, 15 Nov 2011 00:00:00 GMT</pubDate>
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			<title>0.25mm Pitch FPC Connectors: Smaller Flexible Printed Circuit Connectors to Meet Miniaturization Trend </title>
			<description>&lt;p&gt;SHANGHAI, China -- July 19, 2011 -- In view of the continuing trend of miniaturization in the consumer devices market, TE Connectivity, formerly Tyco Electronics, today announced 0.25mm pitch Flexible Printed Circuit (FPC) connectors (slanting-inserted FPC type).&lt;/p&gt;

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			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1907</link>
			<pubDate>Mon, 18 Jul 2011 00:00:00 GMT</pubDate>
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			<title>Spring Finger Family Provides Better Internal Connection for a Wider Range of Mobile Devices</title>
			<description>&lt;p&gt;SHANGHAI, China -- June 28, 2011 -- As the demand for electronic devices continues to increase, so does the need for internal connections within these devices.  In response to this trend, TE Connectivity (TE), formerly Tyco Electronics, offers scalable spring fingers as well as a complete family of spring fingers to serve this surging need.&lt;/p&gt;</description>
					
			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1893</link>
			<pubDate>Mon, 27 Jun 2011 00:00:00 GMT</pubDate>
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			<title>High Performance 0.6 mm Centerline High-Speed CHAMP Docking Series Connector</title>
			<description>&lt;p&gt;Shanghai, China -- June 8, 2011 -- To meet the increasing market demand for hybrid I/O connectors, TE Connectivity (TE) has introduced a 0.6 mm CL (centerline) high-speed CHAMP docking series connector.&lt;/p&gt;

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			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1876</link>
			<pubDate>Tue, 07 Jun 2011 00:00:00 GMT</pubDate>
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			<title>New iTouch Plus Surface Acoustic Wave Touchscreen Couples Zero-Bezel Design with Multi-Touch Functionality</title>
			<description>&lt;p&gt;HARRISBURG, Pa. -- May 12, 2011 -- TE Connectivity announced today its iTouch Plus multi-touch touchscreen technology meets the Windows 7 multi-touch additional qualification requirements.  The TE Touch Solutions business unit, a global leader in touchscreen technology, is exhibiting both the iTouch and iTouch Plus touchscreen technologies along with its extensive product portfolio at the 2011 Society for Information Display (SID) International Exhibition May 17-19 Los Angeles Convention Center, booth#1149.&lt;/p&gt;</description>
					
			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1882</link>
			<pubDate>Thu, 12 May 2011 00:00:00 GMT</pubDate>
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			<title>High-Performance LCD Coaxial Embedded Display Interface (LCEDI) and LCEDI SR (Source Receptacle)</title>
			<description>&lt;p&gt;SHANGHAI, China -- Feb. 15, 2011 -- The rapidly developing tablet, notebook and netbook PC markets are creating demand for high-performance interconnects with sufficient throughput to drive the latest display technology.&lt;/p&gt;</description>
					
			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1865</link>
			<pubDate>Tue, 15 Feb 2011 00:00:00 GMT</pubDate>
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			<title>ChipSESD Protection Devices in Standard 0201 &amp; 0402 Packages</title>
			<description>&lt;p&gt;MENLO PARK, CA -- Feb. 2, 2011 -- Tyco Electronics (TE) has announced the expansion of its silicon ESD (electrostatic discharge) protection product portfolio with the introduction of 0201- and 0402-size devices that are easier to install and rework than traditional semiconductor-packaged ESD devices.  The ChipSESD package combines the advantages of an active silicon device with a traditional Surface-Mount Technology (SMT) passive packaging configuration.&lt;/p&gt;</description>
					
			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1863</link>
			<pubDate>Wed, 02 Feb 2011 00:00:00 GMT</pubDate>
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			<title>USB 3.0 Connector </title>
			<description>&lt;p&gt;Shanghai, China -- Jan 4, 2011 -- As newer consumer devices and computer peripherals become more memory intensive, the need for much higher data transfer rates is more evident than ever.&lt;/p&gt;

&lt;p&gt;With such requirements in mind, Tyco Electronics (TE), a voting member of Universal Serial Bus-Implementers Forum (USB-IF), is pleased to release a new USB 3.0 connector, which retains all the great features of previous generations of USB interconnects while improving performance and power management.&lt;/p&gt;

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			<link>http://www.te.com/AboutUs/news/prodnews.asp?ID=1854</link>
			<pubDate>Tue, 04 Jan 2011 00:00:00 GMT</pubDate>
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