1-331677-1 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR AU SER-3 - 1-331677-1

  • TE Internal Number: 1-331677-1

active
  • Sleeve Style Closed Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 6.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .41
  • Mating Pin Diameter Range .66 – .74
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-331677-4 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR AU SER-3 - 1-331677-4

  • TE Internal Number: 1-331677-4

active
  • Sleeve Style Closed Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 6.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-332070-1 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR AU SER-4 - 1-332070-1

  • TE Internal Number: 1-332070-1

active
  • Sleeve Style Closed Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .653
  • Mating Pin Diameter Range .94 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-332070-3 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H AU SER-4 - 1-332070-3

  • TE Internal Number: 1-332070-3

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .518 – .653
  • Mating Pin Diameter Range .86 – .94
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-332070-4 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H AU SER-4 - 1-332070-4

  • TE Internal Number: 1-332070-4

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .653
  • Mating Pin Diameter Range .94 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-332070-7 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/KO AU SER-4 - 1-332070-7

  • TE Internal Number: 1-332070-7

active
  • Sleeve Style Knockout Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .653
  • Mating Pin Diameter Range .94 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-5050871-0 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H SN-AU SER-5 - 1-5050871-0

  • TE Internal Number: 1-5050871-0

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size 1.04 – 1.65
  • Mating Pin Diameter Range 1.27 – 1.45
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-5050871-9 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H SN-AU SER-5 - 1-5050871-9

  • TE Internal Number: 1-5050871-9

  • Alias ID: 1412352

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size 1.31 – 2.08
  • Mating Pin Diameter Range 1.42 – 1.65
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-50865-2 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

MSS, SER-4 OPEN BOTTOM, AU/AU - 1-50865-2

  • TE Internal Number: 1-50865-2

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-50871-0 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H SN-AU SER-5 - 1-50871-0

  • TE Internal Number: 1-50871-0

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size 1.04 – 1.65
  • Mating Pin Diameter Range 1.27 – 1.45
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag