1-331677-4 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR AU SER-3 - 1-331677-4

  • TE Internal Number: 1-331677-4

active
  • Sleeve Style Closed Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 6.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Wire/Cable Size .41 – .518
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-332070-4 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H AU SER-4 - 1-332070-4

  • TE Internal Number: 1-332070-4

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size .653
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-5050871-0 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H SN-AU SER-5 - 1-5050871-0

  • TE Internal Number: 1-5050871-0

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size 1.04 – 1.65
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-5050871-9 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H SN-AU SER-5 - 1-5050871-9

  • TE Internal Number: 1-5050871-9

  • Alias ID: 1412352

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size 1.31 – 2.08
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-50871-3 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR AU SER-5 - 1-50871-3

  • TE Internal Number: 1-50871-3

active
  • Sleeve Style Closed Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size 1.04 – 1.65
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-50871-8 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H AU SER-5 - 1-50871-8

  • TE Internal Number: 1-50871-8

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size 1.31 – 2.08
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-50871-9 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/H SN-AU SER-5 - 1-50871-9

  • TE Internal Number: 1-50871-9

active
  • Sleeve Style Open Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 7.5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness .76
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size 1.31 – 2.08
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-5331677-6 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR SN SER-3 - 1-5331677-6

  • TE Internal Number: 1-5331677-6

active
  • Sleeve Style Closed Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness 2.5
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness 2.54
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Wire/Cable Size .205 – .258
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-5332095-9 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

SOCKET,MIN-SPR W/KO SN-AU S-1 - 1-5332095-9

  • TE Internal Number: 1-5332095-9

active
  • Sleeve Style Knockout Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness .762
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size .081 – .162
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Packaging Quantity 2000
  • Packaging Method Bag
1-5380758-0 Discrete Sockets
PRODUCT

Connectors - Discrete Sockets

RCR SN-SPR SN-CUP 036-051 - 1-5380758-0

  • TE Internal Number: 1-5380758-0

active
  • Sleeve Style Closed Bottom
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Applies To Printed Circuit Board
  • Sealant Without
  • Spring Material Beryllium Copper
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating 4
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Spring Plating Thickness 2.03
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Thickness 2.54
  • Socket Type Discrete
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Wire/Cable Size .518 – 1.31
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 126
  • Packaging Quantity 2000
  • Packaging Method Bag