2308107-8 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Green
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
2-2199154-8 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Boardlock Material Stainless Steel
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Box & Tray
2199155-1 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 288
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .85
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Hard Tray
2308107-1 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Black
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Black
  • Solder Tail Contact Plating Material Tin over Nickel
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
2308107-2 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Blue
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
2308107-3 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Green
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
2308107-4 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Black
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Black
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
2308107-6 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Blue
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
2308107-7 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
2309409-4 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 260
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.2
  • SGRAM Voltage 1.2
  • Ejector Type Locking
  • Retention Post Location Both Ends
  • Module Key Type Offset Left
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .381
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • Centerline (Pitch) .5
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 800