LITESURF Plating Technology - Interview with Dr. Erika Crandall, Senior R&D Product Development Engineer. In this video section, you will learn what is TE's LITESURF plating and how it helps to solve the challenge of tin whiskers.
What is LITESURF Plating and how does it solve the challenge of tin whiskers?
TE Connectivity’s LITESURF deposit, it is a Bismuth-based deposit, and therefore it is a harmless non-toxic plating. It was specifically produced to easily replace out tin in any production plating line. This comes with many advantages against whisker growth.
First, being that here we have now a Bismuth film, replacing what used to be a Tin film. So there is no more Tin. No more Tin, no more Tin whiskers. Second, Bismuth is not a highly motivating whisker producer like Tin is. And third being that the conductivity of Bismuth is one-tenth that of Tin. Now, remember the whole reason these whiskers pose such a threat in our electronic systems lies in the fact that they are electrically conductive. So the fact that Bismuth is one-tenth the conductivity of Tin, simply means that even if a Bismuth whisker did grow, it is just that much less of a concern or threat as it stands today using Tin.
Now this LITESURF plating it has been deposited and tested on signal press-fit pins where it has shown itself to reduce the whole whisker risk by over 1600 times that of tin today. Making it in any case a very promising solution for our future not just for press-fit pin applications but for the reliability of Automotive all together.
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