1.27 mm board-to-board and wire-to-board solutions
AMPMODU 50/50 Grid connectors include a variety of high-density board-to-board and wire-to-board headers and receptacles with a .050" x .050" (1.27 mm x 1.27 mm) pitch centerline. With a 3.9 A max current rating, these connectors accept 28 - 20 AWG (0.32 - 0.81 mm) wire size in an Insulation Displacement Contact (IDC) termination style.
Features
3 header stack heights (.250”, .320” & .390”):
- Accommodates 3 different mezzanine stack heights.
Positive latch:
- Provides for reliable secure connector locking & functionality in high-vibe environments.
Polarization feature:
- Helps protect contacts and reduces the chances of incorrect mating.
Non-protrusive hold-downs:
- Allows surface mounting on both sides of board.
- Provides retention during soldering & long-term strain relief for solder joints.
T&R packaging with caps available:
- Compatible with robotic assemblies.
Stand-offs on housings:
- Allows removal of solder flux.
Typical Applications
- Industrial controls
- Building and home automation devices
- Servo drives
- Programmable logic controllers (PLCs) and other I/O devices
- Telecommunications equipment
- Robotics
- Instrumentation and test equipment
- Medical equipment
