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Overview
DDR4 DIMM SOCKETS
DDR4 DIMM Sockets are designed to JEDEC industry standards. They are available with through hole and surface mount configurations. DDR4 DIMM Socket applications include servers, communications equipment, workstations, and high-performance computing.
Product Features
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DRAM Type: Double Data Rate (DDR) 4
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Number of Positions: 288
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Module Orientation: Vertical
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Centerline (Pitch)(mm): .85
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Ejector Type: Standard
Overview
Product Features
DDR4 Sockets
- Various mounting types: through hole, surface mount, and press fit
- Narrow and standard extractor options
- Various color options for connector housing and extractor
- Accepts memory module per JEDEC MO-309
.85mm
Memory module pitch
288
Number of positions
2.4mm
Seating plane height
TE's DDR4 DIMM sockets are high quality memory sockets designed for use in always-on applications such as data center servers.
PRODUCT ALTERNATIVES
Select Applications
DDR4 Sockets
- Servers
- Storage
- Communications equipment
- Desktop PCs
Features
Please review product documents or contact us for the latest agency approval information.
Product Type Features
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Connector & Contact Terminates To Printed Circuit Board
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DRAM Type Double Data Rate (DDR) 4
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Connector System Board-to-Board, Board-to-Bus Bar
Configuration Features
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Number of Rows 2
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Number of Positions 288
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Module Orientation Vertical
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Number of Keys 1
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Number of Bays 2
Electrical Characteristics
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DRAM Voltage (V) 1.2
Body Features
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Connector Profile Standard
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Ejector Type Standard
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Module Key Type Offset Right
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Retention Post Location None
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Latch Material High Temperature Thermoplastic
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Ejector Location Both Ends
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Latch Color Black, Blue, Natural
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Ejector Material High Temperature Thermoplastic
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Ejector Material Color Black, Blue (2935U), Blue, Green, Natural
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PCB Retention Feature Material Stainless Steel
Contact Features
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Contact Base Material Copper Alloy
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PCB Contact Termination Area Plating Material Tin
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Contact Underplating Material Nickel
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Contact Mating Area Plating Material Gold
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Contact Mating Area Plating Material Thickness (µm) .38, .51, .76
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Contact Mating Area Plating Material Thickness (µin) 15, 20, 30
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PCB Contact Termination Area Plating Material Thickness 3 µm [ 118.1 µin ]
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Contact Current Rating (Max) (A) .75
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Socket Style DIMM
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Memory Socket Type Memory Card
Termination Features
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Termination Post & Tail Length (mm) 2.1, 2.67, 3.18
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Termination Post & Tail Length (in) .083, .105, .125
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Termination Method to Printed Circuit Board Surface Mount, Through Hole - Solder
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Insertion Style Direct Insert
Mechanical Attachment
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Connector Mounting Type Board Mount
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PCB Mount Retention Type Boardlock
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PCB Mount Retention With
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Mating Alignment With, Without
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Mating Alignment Type Offset Right
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Mount Angle Vertical
Housing Features
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Housing Color Black, Blue, Green, Natural, Yellow
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Housing Material High Temperature Nylon, High Temperature Thermoplastic
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Centerline (Pitch) .85 mm [ .033 in ]
Dimensions
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Profile Height from PCB 20 mm [ .787 in ]
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Row-to-Row Spacing 2.2 mm [ .08 in ]
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Center Retention Hole Diameter 1.2 mm [ .047 in ]
Usage Conditions
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Operating Temperature Range -55 – 105 °C [ -67 – 221 °F ]
Operation/Application
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Circuit Application Signal
Industry Standards
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UL Flammability Rating UL 94V-0
Packaging Features
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Packaging Quantity 80
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Packaging Method Box & Tray, Hard Tray, Tray
Reference Number
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TE Internal Number CAT-D3304-SO1399
Related Materials
No documentation available.
JEDEC is a trademark of its respective owner.
