1367629-2 SFP/SFP+/zSFP+  1
INF-8074i
  • Form Factor SFP
  • Product Type Cage
  • Cage Type Single
  • Included Heat Sink No
  • Integrated Lightpipes No
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Lightpipe Configuration Dual Round
  • Lightpipe Style Standard
  • Lightpipe Profile Standard
  • Number of Ports 1
  • Data Rate (Max) 4
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Copper Alloy
  • Tail Length 3
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 85
  • For Use With Pluggable I/O Products SFP SMT Connector
  • Pluggable I/O Applications SFP
  • Heat Sink Compatible No
  • Packaging Method Box & Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
1-2198325-9 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+(SFP28)
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 2
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 4
  • Number of Positions 80
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Pluggable I/O Applications SFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
2227728-1 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly
  • Cage Type Ganged
  • Included Heat Sink No
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 2
  • Number of Ports 2
  • Data Rate (Max) 32
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Tail Length 2.05
  • PCB Thickness (Recommended) 2.25
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Circuit Application Signal
  • Heat Sink Compatible No
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe No
2057630-1 CFP/CFP2/CFP4  1
CFP
  • Product Line CFP
  • Form Factor CFP
  • Product Type Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Number of Positions 148
  • Data Rate (Max) 100
  • Plating Material Gold
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mounting Style Double-Sided (Belly-to-Belly)
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .8
  • PCB Thickness (Recommended) 2
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • Packaging Method Reel
2057629-1 CFP/CFP2/CFP4  1
CFP
  • Product Line CFP
  • Form Factor CFP
  • Product Type Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Number of Positions 148
  • Data Rate (Max) 100
  • Plating Material Gold
  • Termination Method to Printed Circuit Board Straddle Mount
  • PCB Mounting Style Straddle Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .8
  • PCB Thickness (Recommended) 1.44
  • Operating Temperature Range -55 – 85
  • For Use With Pluggable I/O Products CFP Assembly
  • Circuit Application Signal
  • Packaging Method Box & Tray
1367646-4 SFP/SFP+/zSFP+  1
INF-8074i
  • Form Factor SFP
  • Product Type Accessory
  • Cage Type Single
  • Included Heat Sink No
  • Pluggable I/O Accessory Type Heat Sink Clip
  • Heat Sink Compatible Yes
  • Packaging Method Tray
1367645-6 SFP/SFP+/zSFP+  1
INF-8074i
  • Form Factor SFP
  • Product Type Cage Assembly
  • Cage Type Single
  • Included Heat Sink Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Number of Ports 1
  • Data Rate (Max) 4
  • Heat Sink Style Pin
  • Heat Sink Height Class Networking
  • Heat Sink Height 13.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Copper Alloy
  • Tail Length 3
  • PCB Thickness (Recommended) 2.25
  • Operating Temperature Range -55 – 85
  • For Use With Pluggable I/O Products SFP SMT Connector
  • Pluggable I/O Applications SFP
  • Circuit Application Signal
  • Heat Sink Compatible Yes
  • Packaging Method Box & Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe No
1-2180324-7 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+(SFP28)
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 4
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 8
  • Number of Positions 160
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Pluggable I/O Applications zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2180324-9 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+(SFP28)
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 4
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 8
  • Number of Positions 160
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Pluggable I/O Applications zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
1-2198346-7 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+(SFP28)
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable Yes
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 6
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 12
  • Number of Positions 320
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Pluggable I/O Applications zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2198346-9 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+(SFP28)
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 8
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 16
  • Number of Positions 320
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Pluggable I/O Applications zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
2274283-1 CFP/CFP2/CFP4  1
CFP
  • Product Line CFP
  • Form Factor CFP
  • Product Type Accessory
  • Included Heat Sink Yes
  • Pluggable I/O Accessory Type Heat Sink
  • Data Rate (Max) 100
  • Heat Sink Style Fin
  • Heat Sink Height 5
  • Heat Sink Finish Anodized Black
  • PCB Thickness (Recommended) 2
  • For Use With Pluggable I/O Products CFP Assembly
  • Packaging Method Box & Tray
2274284-1 CFP/CFP2/CFP4  1
CFP
  • Product Line CFP
  • Form Factor CFP
  • Product Type Accessory
  • Pluggable I/O Accessory Type Hardware Kit
  • Heat Sink Style Fin
  • Heat Sink Height 5
  • Heat Sink Finish Anodized Black
  • Termination Method to Printed Circuit Board Screw
  • PCB Mounting Style Single-Sided
  • PCB Thickness (Recommended) 2
  • For Use With Pluggable I/O Products CFP Connector System
  • Packaging Method Box & Carton
1515747-1 Expanded Beam Fiber Optics
  • Product Type Insert Assembly
  • Mode Multimode
  • Number of Channels 4
  • Operating Wavelength 850 – 1300
1918931-5 Expanded Beam Fiber Optics
  • Product Type Cable Adapter Kit
  • Booted Yes
  • Shell Material Aluminum Alloy
  • Shell Finish Hard Anodize
  • Boot Material EPDM
  • Mounts To Plug
  • Outside Cable Diameter (Max) 5.5
2170614-1 SFP/SFP+/zSFP+
INF-8074i
  • Form Factor SFP
  • Product Type Cage Assembly
  • Cage Type Single
  • Included Heat Sink No
  • Integrated Lightpipes No
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Lightpipe Configuration Dual Round
  • Lightpipe Style Standard
  • Lightpipe Profile Standard
  • Number of Ports 1
  • Data Rate (Max) 4
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Copper Alloy
  • Tail Length 3
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products SFP SMT Connector
  • Pluggable I/O Applications SFP+
  • Circuit Application Signal
  • Heat Sink Compatible No
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
1367645-4 SFP/SFP+/zSFP+  1
INF-8074i
  • Form Factor SFP
  • Product Type Cage Assembly
  • Cage Type Single
  • Included Heat Sink Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Number of Ports 1
  • Data Rate (Max) 4
  • Heat Sink Style Pin
  • Heat Sink Height Class PCI
  • Heat Sink Height 4.2
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Copper Alloy
  • Tail Length 3
  • PCB Thickness (Recommended) 2.25
  • Operating Temperature Range -55 – 85
  • For Use With Pluggable I/O Products SFP SMT Connector
  • Pluggable I/O Applications SFP
  • Circuit Application Signal
  • Heat Sink Compatible Yes
  • Packaging Method Box & Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe No
1-2198318-7 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+(SFP28)
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 1
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 2
  • Number of Positions 40
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Pluggable I/O Applications zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
2198720-1 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+(SFP28/56)
  • Product Type Cage Assembly
  • Cage Type Ganged
  • Included Heat Sink No
  • Connector System Cable-to-Board
  • Sealable Yes
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 2
  • Number of Ports 2
  • Data Rate (Max) 32
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Tail Length 2.05
  • PCB Thickness (Recommended) 3
  • Operating Temperature Range -55 – 105
  • For Use With Pluggable I/O Products zSFP+ SMT Connector
  • Circuit Application Signal
  • Heat Sink Compatible No
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe No