380635-1 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.45
  • Hole Size (Recommended) 2.26
  • Wire Size 25 – 19
  • Wire Size .162 – .653
  • Mating Pin Diameter Range .46 – 1.02
  • Operating Temperature Range -65 – 126
  • Circuit Application Power & Signal
5050871-5 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 18 – 17
  • Wire Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
5380635-2 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.45
  • Hole Size (Recommended) 2.26
  • Wire Size 25 – 19
  • Wire Size .162 – .653
  • Mating Pin Diameter Range .46 – 1.02
  • Operating Temperature Range -65 – 126
  • Circuit Application Power & Signal
6-5330808-5 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
50935 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 4.27
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
50863-4 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.6
  • Hole Size (Recommended) 1.32
  • Wire Size 28 – 22
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
1-5380758-0 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.65
  • Hole Size (Recommended) 2.26
  • Wire Size 20 – 16
  • Wire Size .518 – 1.31
  • Mating Pin Diameter Range .91 – 1.3
  • Operating Temperature Range -65 – 126
  • Circuit Application Power & Signal
50863 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.6
  • Hole Size (Recommended) 1.32
  • Wire Size 28 – 22
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
2-331677-6 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 20 – 21
  • Wire Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
5050871-1 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 18 – 17
  • Wire Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
2-5331677-2 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 20 – 21
  • Wire Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
322-HCS6P2-100 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 3.45
  • Hole Size (Recommended) 1.61
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .51 – .76
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
2-5332070-3 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire Size 19
  • Wire Size .653
  • Mating Pin Diameter Range .94 – 1.02
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
2-5050871-3 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 16 – 14
  • Wire Size 1.31 – 2.08
  • Mating Pin Diameter Range 1.42 – 1.65
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
1-50871-8 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 16 – 14
  • Wire Size 1.31 – 2.08
  • Mating Pin Diameter Range 1.42 – 1.65
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
5050871-8 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 18 – 17
  • Wire Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
5050865-5 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire Size 20 – 18
  • Wire Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
5050864-6 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire Size 22 – 20
  • Wire Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
5050865-8 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire Size 20 – 18
  • Wire Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
2-330808-8 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealant No
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal