5050871-5 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
6-5330808-5 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
50935 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.27
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
50863-4 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
50863 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-331677-6 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050871-1 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5050871-3 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size 1.31 – 2.08
  • Mating Pin Diameter Range 1.42 – 1.65
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
1-50871-8 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size 1.31 – 2.08
  • Mating Pin Diameter Range 1.42 – 1.65
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050871-8 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire/Cable Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050865-5 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050864-6 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050865-8 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5331272-7 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .205 – .258
  • Mating Pin Diameter Range .56 – .64
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-331677-9 Discrete Sockets  1
  • Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
322-HCS5P2-100 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 2.54
  • Hole Size (Recommended) 1.04
  • Mating Pin Diameter Range .28 – .46
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 2500
  • Spring Material Beryllium Copper
9-1437514-0 Discrete Sockets  1
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Mating Pin Diameter Range .66 – .74
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2500
  • Spring Material Beryllium Copper
3-5331677-8 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .41
  • Mating Pin Diameter Range .66 – .74
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
1-5645956-1 Discrete Sockets  1
  • Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.67
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
5050864-1 Discrete Sockets  1
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper