1734099-8 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 80
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 80
  • Voltage 12
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 500
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .05
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 13.2
  • Height 7.5
  • Operating Temperature Range -35 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 21
1-1734100-0 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.904
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Vertical
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 2.54
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • PCB Thickness (Recommended) .8 – 1.6
  • Tail Length .76
  • Operating Temperature Range -55 – 105
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
  • Packaging Quantity 54
1-1734037-0 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom Without
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 100
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Height 7.65
  • Tail Length .76
  • Operating Temperature Range -55 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 21
1734099-4 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 40
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 40
  • Voltage 12
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 500
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .05
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 13.2
  • Height 7.5
  • Operating Temperature Range -35 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 45
1734099-7 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 68
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 68
  • Voltage 12
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 500
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .05
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 13.2
  • Height 7.5
  • Operating Temperature Range -35 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 30
1734037-4 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom Without
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 40
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 40
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Height 7.65
  • Tail Length .76
  • Operating Temperature Range -55 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 45
1734037-5 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom Without
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 50
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 50
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Height 7.65
  • Tail Length .76
  • Operating Temperature Range -55 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 35
1734101-8 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.904
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 80
  • Board-to-Board Configuration Vertical
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 80
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.8
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 2.54
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • PCB Thickness (Recommended) .8 – 1.6
  • Height 10
  • Tail Length .76
  • Operating Temperature Range -55 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 864
1734100-5 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.904
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 50
  • Board-to-Board Configuration Vertical
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 50
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 2.54
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • PCB Thickness (Recommended) .8 – 1.6
  • Tail Length .76
  • Operating Temperature Range -55 – 105
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
  • Packaging Quantity 54
1734100-4 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.904
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 40
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 2.54
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • PCB Thickness (Recommended) .8 – 1.6
  • Tail Length .76
  • Operating Temperature Range -55 – 105
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 54
1734101-6 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.904
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 60
  • Board-to-Board Configuration Vertical
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 60
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.8
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.4
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • PCB Thickness (Recommended) 2.36
  • Height 10
  • Tail Length .76
  • Operating Temperature Range -55 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 54
1734098-7 Board-to-Board Headers & Receptacles  1
  • Connector System Wire-to-Board
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Connector Style Receptacle
  • Sealed Bottom Without
  • Series Series I
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 68
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 68
  • Voltage 12
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness 1.27
  • Contact Type Socket
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Cable Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Polyester
  • PCB Thickness (Recommended) 1.42 – 1.72
  • Height 15.27
  • Tail Length 1.27
  • Operating Temperature Range -35 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
  • Packaging Quantity 50
1734098-4 Board-to-Board Headers & Receptacles  1
  • Connector System Wire-to-Board
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Connector Style Receptacle
  • Sealed Bottom Without
  • Series Series I
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 40
  • Voltage 12
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness 1.27
  • Contact Type Socket
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Cable Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Polyester
  • PCB Thickness (Recommended) 1.42 – 1.72
  • Height 15.27
  • Tail Length 1.27
  • Operating Temperature Range -35 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
  • Packaging Quantity 50
1734101-7 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.904
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 68
  • Board-to-Board Configuration Vertical
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 68
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.8
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 2.54
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • PCB Thickness (Recommended) .8 – 1.6
  • Height 10
  • Tail Length .76
  • Operating Temperature Range -55 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 54
3-5175475-8 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom Without
  • Series High Density (HD)
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 68
  • Board-to-Board Configuration Vertical
  • Number of Rows 1
  • Insulation Resistance 68
  • Voltage 250
  • Insulation Resistance 1
  • PCB Retention Feature Plating Material Tin over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Configuration Single Tine
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .5
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Layout Inline
  • PCB Contact Termination Area Plating Thickness 1
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Nylon - GF
  • Height 7
  • Operating Temperature Range -55 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 80
1734037-7 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom Without
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 68
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 750
  • Insulation Resistance 68
  • Voltage 250
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 750
  • PCB Retention Feature Plating Material Tin
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Height 7.65
  • Tail Length .76
  • Operating Temperature Range -55 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Package
  • Packaging Quantity 30
1734099-6 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.905
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Series I
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 60
  • Board-to-Board Configuration Right Angle
  • Number of Rows 4
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 60
  • Voltage 12
  • Insulation Resistance 4
  • Busbar Mating Area Plating Thickness 500
  • PCB Retention Feature Plating Material Tin-Copper over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness .05
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Layout Matrix
  • PCB Contact Termination Area Plating Thickness 3.81
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 13.2
  • Height 7.5
  • Operating Temperature Range -35 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 30
5176381-3 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom Without
  • Series FH (Free Height)
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 80
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Insulation Resistance 80
  • Voltage 250
  • Insulation Resistance 1
  • PCB Retention Feature Plating Material Tin
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .3
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • Contact Layout Inline
  • PCB Contact Termination Area Plating Thickness 1
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • PCB Mount Retention Type Boardlock
  • Mating Alignment With
  • Mating Alignment Type Guide Pins
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Nylon - GF
  • Mating Post Length 3.64
  • Height 16.2
  • Operating Temperature Range -55 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Interconnections Requiring Variable Stacking Heights
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 70
5917631-4 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom With
  • Series FH (Free Height)
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 100
  • Insulation Resistance 2
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .3
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole
  • Termination Post Length 3.1
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Thermoplastic
  • Height 7
  • Operating Temperature Range -55 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 60
6123283-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Sealed Bottom Without
  • Series Blindmate
  • Connector Type Connector Assembly
  • Profile Standard
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Insulation Resistance 40
  • Insulation Resistance 1
  • PCB Retention Feature Plating Material Tin over Nickel
  • PCB Retention Feature Material Brass
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1
  • Contact Type Pin
  • Contact Layout Inline
  • PCB Contact Termination Area Plating Thickness 1
  • Termination Method to Printed Circuit Board Surface Mount
  • Termination Post Length 2.2
  • PCB Mount Retention Type Boardlock
  • Mating Alignment Without
  • PCB Mount Retention With
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Height 18.2
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 50