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Antennas for the Internet of Things
These new embedded antennas address increasing needs in smaller and thinner devices.
Key Features Improve Ruggedness, EMI Performance in Next-Generation I/O Standard
TE introduced three low-profile block connectors: the 0.3H block SIM, 0.3H block side-entry SIM, and 0.3H block micro SD.
TE announces of a new, third-form-factor (3FF), micro-SIM card connector solution for mobile and smartphones on August 19, 2014.
On September 2013, we announced new board level shielding products for the new electromagnetic interference (EMI) challenges created by increases in mobile device complexity.
On July 11, 2013, we announced our 0.35mm fine pitch, scalable board-to-board connector, designed for high performance and thinner mobile devices.
The new line of M.2 next generation form factor (NGFF) connectors are smaller in both size and volume. Engineered for a wide range of applications, these M.2 NGFF connectors meet both current and future market needs for slim solutions.
Our new, low-profile battery connector with a height of 1.9mm, provides you with flexibility for your mobile device design, a reliable connection, and a competitive production cost.
Our new, low profile, single-sided double-data-rate 3 (DDR3) small outline dual in-line memory module (SODIMM) connector delivers peak performance with high-speed data applications.
On January 23, 2013, we released our ultra low profile push-pull micro SIM connector, an advanced hardware solution designed to increase efficiency while reducing end-product cost and size.
This novel 0.4mm fine pitch board-to-board (BtB) connector features a stack height of 0.6mm and is designed to meet the increasing demand for thinner and smaller consumer electronics devices.
You are designing the new, slimmer devices your customers take everywhere. We designed our new IP68 waterproof micro USB 2.0 connector to help protect your design.
Our new side-protected spring fingers address common assembly issues like tangling and deflection during transfer so you can design and deliver your solutions with greater ease.