TE's LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB).
TE's DDR4 DIMM sockets are high quality memory sockets designed for use in always-on applications such as data center servers.
TE's Z-PACK TinMan connectors increase system performance within the interconnection channel with a proven performer which reduces the system characteristic impedance from 100 ohm to 85 ohm.
TE's MULTI-BEAM XLE connectors feature a new 3-beam contact, made from a thicker (higher) conductivity material than the original single-beam or 4-beam designs.
Due to the latest high speed demands in networking equipment TE developed Sliver internal cabled interconnects which provides one of the most flexible solutions in the market for making internal I/O connections on the board. Sliver products can be used across many applications, data rates and protocols (PCI Express, SAS, Ethernet).
We are at the forefront of data center connectivity, creating a broad, innovative portfolio for enterprise and hyperscale applications. Our cutting-edge solutions anticipate today’s big data needs – and account for tomorrow’s forward-looking designs. We don’t just follow industry standards; we create them. By developing products that are smaller, faster, and more agile, we meet growing design needs for the next generation of data centers. We have big ideas – and these big ideas translate to lasting solutions for a growing market.Contact Us
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