Featured Product: LGA 3647 IC Socket

TE Connectivity (TE), a world leader in connectivity and sensors, today announced its LGA 3647 Socket for Intel Corporation’s new processors specified under their new server platforms. TE’s LGA 3647 socket meets the next-generation design requirements of these latest CPU processors for higher performance and better system scaling. As one of only two validated suppliers of this technology, TE is a key source of this vital socket for new platforms used in data centers and high performance computing (HPC).

TE’s LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). As computing power increases, processor chips’ pin counts are increasing. The LGA 3647 socket is the first LGA socket to feature a two-piece design for the larger processor that improves issues with warpage and offers better coplanarity and reliability in connectivity. TE’s flexible tooling also provides fast turnaround on prototypes so engineers can have sockets in hand at the earliest stages of the design process.

“Designers using the latest CPU processors for new server platforms and HPC applications needs CPU sockets that deliver performance and reliable connectivity,” said Jaren May, manager of product management for TE’s Data and Devices unit. “Our LGA 3647 socket enables new system designs that deliver leading-edge performance through a robust design that addresses the demands of these next-generation processors.”