Featured Product: Board Level Shielding Products

SHANGHAI – With increasing mobile device complexity and functionality, there is a growing need for thinner devices with multiple antennas, higher data rates and increasing operating frequencies. This market change is driving increased demand for board level shielding that solves these new EMI challenges. With that in mind, TE Connectivity (TE) is introducing board level shielding (BLS) products. TE board level shields are stamped or drawn one- and two-piece metal cages that help provide isolation of board level components, minimize crosstalk and reduce electromagnetic interference (EMI) susceptibility without impacting system speed.

“Stamping, forming and automation have been TE core competencies for decades,” said Frank Basile, product manager, TE Consumer Devices. “With the introduction of BLS, we are able to leverage these competencies into customer benefits that allow faster time-to-market and volume, at competitive prices.”

The latest BLS product will use standardized features, such as contact and locking dimples, corner shape and bending radii. Regional field application engineers in the U.S., Europe and China are available to provide fast and reliable customer support. Sample turnaround time for customized BLS parts is about 72 hours, depending on complexity.

Our BLS products are yet another example of TE leveraging global scale and low-cost manufacturing to benefit our customers.