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About TE Connectivity (TE)
Industry & New Product News
July 11, 2013
On July 11, 2013, we announced our 0.35mm fine pitch, scalable board-to-board connector, designed for high performance and thinner mobile devices.
May 22, 2013
The new line of M.2 next generation form factor (NGFF) connectors are smaller in both size and volume. Engineered for a wide range of applications, these M.2 NGFF connectors meet both current and future market needs for slim solutions.
February 20, 2013
Our new, low-profile battery connector with a height of 1.9mm, provides you with flexibility for your mobile device design, a reliable connection, and a competitive production cost.
February 4, 2013
Our new, low profile, single-sided double-data-rate 3 (DDR3) small outline dual in-line memory module (SODIMM) connector delivers peak performance with high-speed data applications.
January 23, 2013
On January 23, 2013, we released our ultra low profile push-pull micro SIM connector, an advanced hardware solution designed to increase efficiency while reducing end-product cost and size.
January 9, 2013
This novel 0.4mm fine pitch board-to-board (BtB) connector features a stack height of 0.6mm and is designed to meet the increasing demand for thinner and smaller consumer electronics devices.