DesignCon 2019

Industry Tradeshow

Thank you for attending DesignCon 2019

January 30, 2019 - January 31, 2019

January 30-31, 2019

 

Santa Clara Convention Center
Santa Clara, CA

Booth 817

 

Engaging Booth Demos

Click on the links below to view our innovative solutions live from DesignCon 2019 highlighting performance and next-generation solutions for data centers and the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that you need for your next project. TE’s portfolio of advanced, reliable connectors and other components offer solutions for speed, density, power and connectivity and are driving the next generation of data center applications.

  1. DesignCon 2019: The Future is Fast with TE's 5G Innovations

5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world.

Featured 2019 Products

  • OSFP, QSFP-DD, QSFP, SFP-DD and  high-speed I/O solutions showcasing solutions for disaggregation, density, improved channels, thermal management, co-packaging, and power delivery.
  • The Sliver Interconnect Family has been identified as the standard and required product through several industry groups like COBO, GenZ, EDSFF and Open Compute for today and next gen server and storage designs.  

 

5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world.

We will showcase solid engineering of industry standard interfaces with innovative thermal and power management solutions, meeting the challenges of increasing density and speed in the data center.
Erin Byrne,
Vice President, Engineering and CTO | Data & Devices
DesignCon 2019

Industry Tradeshow

Thank you for attending DesignCon 2019

January 30, 2019 - January 31, 2019

January 30-31, 2019

 

Santa Clara Convention Center
Santa Clara, CA

Booth 817

 

Engaging Booth Demos

Click on the links below to view our innovative solutions live from DesignCon 2019 highlighting performance and next-generation solutions for data centers and the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that you need for your next project. TE’s portfolio of advanced, reliable connectors and other components offer solutions for speed, density, power and connectivity and are driving the next generation of data center applications.

  1. DesignCon 2019: The Future is Fast with TE's 5G Innovations

5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world.

Featured 2019 Products

  • OSFP, QSFP-DD, QSFP, SFP-DD and  high-speed I/O solutions showcasing solutions for disaggregation, density, improved channels, thermal management, co-packaging, and power delivery.
  • The Sliver Interconnect Family has been identified as the standard and required product through several industry groups like COBO, GenZ, EDSFF and Open Compute for today and next gen server and storage designs.  

 

5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world.

We will showcase solid engineering of industry standard interfaces with innovative thermal and power management solutions, meeting the challenges of increasing density and speed in the data center.
Erin Byrne,
Vice President, Engineering and CTO | Data & Devices