Engineering Next-Generation Mobility
By 2030, the automotive landscape will be defined by more sustainable, safer and convenient ways of moving around.
Library of Transportation and Sensor Tech Videos
Watch product videos and application webinars on solutions for transportation and sensor technologies.
Explore Topics on Transportation and Sensor Technologies
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How-to Product Videos and Technology Webinars
- AMPSEAL (1.3 mm) Contact Crimping Instructions
- DEUTSCH DRB Connector Overview & Assembly Instructions
- The Innovative Force Driving Electrification and Sustainability
- Press-Fit Technology for Automotive Applications
- Common TE Extraction Tools for Nano MQS Connectors
- AMPSEAL Connector Overview & Assembly Instructions
- DEUTSCH Contact Crimping Instructions
- Crimp Theory Fundamentals: Basic
- Crimp Theory Fundamentals: Advanced
- Piezoresistive Pressure Transducer Webinar
- AMPSEAL 16 Connector Overview & Assembly Instructions
- From the Charging Inlet through the Battery to the E-Motor
- DEUTSCH DT Family Connector Overview & Assembly Instructions
- DEUTSCH HDP20 & HD30 Connector Overview & Assembly Instructions
- Heavy Duty Sealed Connector Series Overview & Assembly Instructions
- IPT-HD Power Bolt Connector
- LEAVYSEAL Connector Overview & Assembly Instructions
- Micro Pressure Sensor for Minimally Invasive Procedures
- Miniaturized Automotive Connectivity
- NanoMQS - Termination and Loading
- Next Generation Mobility High-Voltage Connectivity Solutions
- OCEAN 2.0 Applicator
- Overview: Pin Insertion Machines
- Scalable Linear Magnetoresistive Sensor Arrays
Enabling Smart Factories with Sensors
Learn about the numerous sensor technologies that enable the operation of smart factories.
Electromagnetic and Thermal Simulations
ADAS and high-resolution sensors enable data transmission and require more power in EV powertrains.
Digital Temperature Sensor Webinar
This webinar explores the trends driving development in digital temperature sensors.
NanoMultispring Press-Fit Technology
Learn about our NanoMultispring contact, developed for PCB end hole diameter 0.6mm and requirements in the IEC 60352-5.
Enabling EVs to Operate at Higher Currents
TE engineers are developing technology solutions in more efficient packaging, enabling EVs to operate at higher currents and voltages for increased driving ranges.
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