ELCON Micro Power Connectors

Deliver High Current Density in Common Industry Footprint

Our ELCON Micro wire-to-board power connectors provide a high current at 12.5A per pin in the common industry footprint of 3.0mm. This current density in a compact design is useful for servers, switches, storage devices and testing machines. A common industry footprint also allows for easy upgrades to existing designs. The connector housing is designed to prevent mating the plug in the wrong direction. This virtually fool-proof mating design makes assembly easy for the customer.

ELCON Micro Power Connectors Features & Benefits

  • High Current Density 
  • Common Footprint 
  • Virtually Fool-Proof Mating
  • Reliable Performance

12.5A

Provides high current at 12.5A per pin in the common industry footprint of 3.0mm (contact pitch)

600V

Working Voltage

HOT

Performs reliably in harsh environments with maximum operating temperature of 105°C

4 Position Header

8 Position Header

16 Position Header