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Overview

Product Features

LGA Sockets
  • Socket housing facilitates efficient soldering to the PCB.
  • Socket is supplied with a cap to facilitate vacuum pick and place.
  • Backplates are available in zinc or nickel plating.
LGA 3647 Socket and Hardware

LGA 3647 Socket and Hardware

  1. LGA 3647 Socket and Hardware (English)

TE’s new LGA 3647 socket and hardware allows designers to take advantage of Intel’s new high performance processors that also offer better system scaling.

Product Details

LGA 3647 Socket
  • Pitch: 0.9906mm Hex
  • SP Height: 2.7mm
  • Cont. NF: 25gf @ nominal def.
  • Pin count: 3647
  • Pin array: 49x74
  • Multi-piece housing: 2 piece
LGA Sockets

LGA Sockets

LGA sockets are the latest socket technology for Intel- and AMD-based LGA microprocessor packages that range in size up to 3647 pins. This generation of LGA sockets provides a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.

Select Applications

LGA Sockets
  • Servers
  • High Performance Computing (HPC)
  • Workstations and desktop computers

Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Connector & Contact Terminates To  Printed Circuit Board

  • Connector System  Board-to-Board

Configuration Features

  • Number of Positions  1823, 1824, 3647

  • Grid Spacing  .9906 x .8585 mm [ .039 x .0338 in ]

Body Features

  • Frame Style  C Shape, Square

Contact Features

  • Contact Base Material  Copper Alloy

  • Contact Mating Area Plating Material  Gold

  • IC Socket Type  LGA 3647

  • Contact Mating Area Plating Material Thickness (µin) 15, 30

  • Contact Current Rating (Max) (A) .5

Termination Features

  • Termination Method to Printed Circuit Board  Surface Mount - Solder Ball

Mechanical Attachment

  • Connector Mounting Type  Board Mount

Housing Features

  • Housing Color  Black

  • Housing Material  High Temperature Thermoplastic

  • Centerline (Pitch) (mm) .86, .99

  • Centerline (Pitch) (in) .034, .039

Usage Conditions

  • Operating Temperature Range  -25 – 100 °C [ -13 – 212 °F ]

Operation/Application

  • Circuit Application  Signal

Industry Standards

  • UL Flammability Rating  UL 94V-0

Packaging Features

  • Packaging Method  Tray

  • Tray Color  Black, Blue

Reference Number

  • TE Internal Number CAT-L59017-A76

Related Materials

No documentation available.