1674459-4 USB Connectors  1
  • USB Type A
  • USB Version 2.0
  • Size Standard
  • Connector Style Receptacle
  • Orientation Right Angle
  • Connector System Cable-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Connector
  • LED Without
  • Number of Ports 1
  • Number of Positions 4
  • Number of Mounting Legs 4
  • Shell Plating Finish Matte
  • Shell Plating Material Tin
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Contact Termination Type Through Hole
  • Termination Method to Printed Circuit Board Wave Solder
  • Termination Method Solder
  • Locating Posts With
  • Mounting Location Top
  • Locking Feature With
  • PCB Connector Seating Flush
  • PCB Mount Retention Type Kinked Legs
  • Panel Mount Feature Type Flange
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2
  • Housing Material Thermoplastic
  • Housing Color Natural
  • PCB Thickness (Recommended) 1
  • Tail Length 1.7
  • Soldering Temperature (Max) 260
  • Mating Cycles (Max) 30000
  • Operating Temperature Range -55 – 85
  • Halogen Free No
  • Pick & Place Capable No
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Industry Standard USB 2.0
  • Moisture Sensitivity Level 1
  • Packaging Method Box & Tray
  • Packaging Quantity 500
5536279-4 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Profile Low
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 100
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Positioning Bosses
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 10.92
  • Tail Length .76
  • Height 8.11
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • Solder Process Feature Board Standoff
  • Packaging Method Tube
  • Packaging Quantity 8
5536254-2 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Profile Low
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 60
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 60
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 10.92
  • Tail Length .76
  • Height 8.11
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • Packaging Method Tube
  • Packaging Quantity 14
RCT-0C Probe Pads
  • Element Type Foil
  • Size Code 0805
  • Resistance Class Up to 1kΩ
  • Tolerance 0%
  • Resistance <.05
  • Power Rating 0
  • Mount Style Surface Mount
  • Dimensions 2 x 1.25 x 1.45
  • Packaging Method Taped & Reeled
RCW-0C Probe Pads
  • Element Type Foil
  • Size Code 1206
  • Resistance Class Up to 1kΩ
  • Tolerance 0%
  • Resistance <.05
  • Power Rating 0
  • Mount Style Surface Mount
  • Dimensions 3.2 x 1.6 x 2
  • Packaging Method Taped & Reeled
182734-2 Wire-to-Board Connector Contacts
  • Connector & Contact Terminates To Wire & Cable
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Contact Base Material Phosphor Bronze
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 2.5
  • Termination Method to Wire & Cable Crimp
  • Wire/Cable Size 28 – 24
  • Wire/Cable Size .08 – .24
  • Insulation Diameter .8 – 1.5
  • Packaging Method Loose Piece
  • Packaging Quantity 200
RCS-0C Probe Pads
  • Element Type Foil
  • Size Code 1206
  • Resistance Class Up to 1kΩ
  • Tolerance 0%
  • Resistance <.05
  • Power Rating 0
  • Mount Style Surface Mount
  • Dimensions 3.2 x 1.6 x 1.25
  • Packaging Method Taped & Reeled
6376608-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Row-to-Row Spacing 2.8
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 80
  • Number of Rows 2
  • Voltage 50
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Type Socket
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness .3
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • Centerline (Pitch) .6
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Entry Style Top
  • Height 13.6
  • Operating Temperature Range -55 – 85
  • Pick and Place Cover Without
  • For Use With Headers
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 45
RCU-0C Probe Pads
  • Element Type Foil
  • Size Code 0603
  • Resistance Class Up to 1kΩ
  • Tolerance 0%
  • Resistance <.05
  • Power Rating 0
  • Mount Style Surface Mount
  • Dimensions 1.6 x .8 x 1.15
  • Packaging Method Taped & Reeled
188746-1 Wire-to-Board Connector Contacts
  • Connector & Contact Terminates To Wire & Cable
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Contact Base Material Phosphor Bronze
  • Crimp Area Plating Thickness 2.51
  • Wire Contact Termination Area Plating Material Tin
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.3
  • Termination Method to Wire & Cable Crimp
  • Wire/Cable Size 28 – 24
  • Wire/Cable Size .08 – .24
  • Insulation Diameter .8 – 1.5
  • Packaging Method Strip
  • Packaging Quantity 20000
188744-1 Wire-to-Board Connector Contacts
  • Connector & Contact Terminates To Wire & Cable
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Contact Base Material Phosphor Bronze
  • Crimp Area Plating Thickness 1.5 – 2.5
  • Wire Contact Termination Area Plating Material Tin
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 2.5
  • Termination Method to Wire & Cable Crimp
  • Wire/Cable Size 28 – 24
  • Wire/Cable Size .08 – .24
  • Insulation Diameter .8 – 1.5
  • Packaging Method Strip
  • Packaging Quantity 20000
5536279-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Profile Low
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 40
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Positioning Bosses
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 10.92
  • Tail Length .76
  • Height 8.11
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • Solder Process Feature Board Standoff
  • Packaging Method Tube
  • Packaging Quantity 20
5536279-3 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Profile Low
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 80
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 80
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Positioning Bosses
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 10.92
  • Tail Length .76
  • Height 8.11
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • Solder Process Feature Board Standoff
  • Packaging Method Tube
  • Packaging Quantity 10
182734-3 Wire-to-Board Connector Contacts
  • Connector & Contact Terminates To Wire & Cable
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Contact Base Material Phosphor Bronze
  • Crimp Area Plating Thickness 2.5
  • Wire Contact Termination Area Plating Material Tin
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.3
  • Termination Method to Wire & Cable Crimp
  • Wire/Cable Size 28 – 24
  • Wire/Cable Size .08 – .24
  • Insulation Diameter .8 – 1.5
  • Packaging Method Loose Piece
  • Packaging Quantity 100
293702-1 Plug & Socket Lighting Connector Accessories  1
  • Connector & Contact Terminates To Wire & Cable
  • Voltage 42
  • Voltage 42
293702-2 Plug & Socket Lighting Connector Accessories  1
  • Connector & Contact Terminates To Wire & Cable
  • Voltage 42
  • Voltage 42
536254-3 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 80
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Voltage 30
  • Insulation Resistance 80
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin-Lead with Nickel underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material High Temperature Thermoplastic
  • Stack Height 10.92
  • Height 8.12
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Mates with Headers
  • Solder Process Feature Board Standoff
  • Packaging Method Package
  • Packaging Quantity 10
536255-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Voltage 30
  • Insulation Resistance 40
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin-Lead with Nickel underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material High Temperature Thermoplastic
  • Stack Height 10.92
  • Height 8.12
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Mates with Headers
  • Solder Process Feature Board Standoff
  • Packaging Method Tube
  • Packaging Quantity 20
5536254-3 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Profile Low
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 80
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 80
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 10.92
  • Tail Length .76
  • Height 8.11
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • Packaging Method Tube
  • Packaging Quantity 10
5536295-4 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Boss No
  • Connector Type Connector Assembly
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Right Angle
  • Number of Positions 100
  • Board-to-Board Configuration Right Angle
  • Number of Rows 2
  • Insulation Resistance 100
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Mating Area Plating Material Gold
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Height 8
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • Packaging Method Tube
  • Packaging Quantity 7