2-2201196-4 Board-to-Board Headers & Receptacles
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Pitch
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 250
  • Voltage 30
  • Insulation Resistance 2
  • Profile Low
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Mating Entry Location Top
  • Centerline (Pitch) .4
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height .98
  • Height .76
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
5-1747257-3 Board-to-Board Headers & Receptacles
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Mate
  • Stackable Yes
  • PCB Mount Orientation Right Angle
  • Number of Positions 80
  • Board-to-Board Configuration Right Angle
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Voltage 250
  • Insulation Resistance 2
  • Profile Low
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .05 – .127
  • Contact Type Tab
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness .05 – .127
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type None
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Color Black
  • Housing Material High heat-resisted resin
  • Stack Height 4
  • Height 4.75
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1000
4-5353512-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Voltage 250
  • Insulation Resistance 2
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type None
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Centerline (Pitch) .5
  • Housing Color Black
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Height 1.2
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
1-2201196-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Shrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Pitch
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 10
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 250
  • Voltage 30
  • Insulation Resistance 2
  • Profile Low
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Type Tab
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Mating Entry Location Top
  • Centerline (Pitch) .4
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height .98
  • Height .76
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
1-2201197-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Header Type Shrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Pitch
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 10
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 250
  • Voltage 30
  • Insulation Resistance 2
  • Profile Low
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Type Socket
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Mating Entry Location Top
  • Centerline (Pitch) .4
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height .98
  • Height .98
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
4-5353515-5 Board-to-Board Headers & Receptacles
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Voltage 250
  • Insulation Resistance 2
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type None
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Centerline (Pitch) .5
  • Housing Color Black
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Height 1.08
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500