2213611-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Make First / Break Last No
  • Stackable No
  • PCB Mount Orientation Horizontal
  • Number of Positions 6
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Housing Color Natural
  • Housing Material LCP
  • Packaging Method Pocket Tape
2213611-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Make First / Break Last No
  • PCB Mount Orientation Horizontal
  • Number of Positions 4
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Housing Color Natural
  • Housing Material LCP
  • Packaging Method Pocket Tape
2213611-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Make First / Break Last No
  • PCB Mount Orientation Horizontal
  • Number of Positions 2
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 3
  • Housing Color Natural
  • Housing Material LCP
  • Packaging Method Pocket Tape
2306038-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 2
  • Board-to-Board Configuration Right Angle
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Circuit Application Power
  • Packaging Method Pocket Tape
2213610-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 2
  • Board-to-Board Configuration Right Angle
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Circuit Application Power
  • Packaging Method Pocket Tape
2213610-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 4
  • Board-to-Board Configuration Right Angle
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Circuit Application Power
  • Packaging Method Pocket Tape
2213610-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 6
  • Board-to-Board Configuration Right Angle
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Circuit Application Power
  • Packaging Method Pocket Tape
2306038-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 4
  • Board-to-Board Configuration Right Angle
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Circuit Application Power
  • Packaging Method Pocket Tape
2306038-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Stackable No
  • Number of Positions 6
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) 3
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Circuit Application Power
  • Packaging Method Pocket Tape