MusicLinear

Case Study

TE’s microQSFP Enables Huawei’s Next-Gen High Density I/O Needs

A Partnership with Huawei 2012 Laboratories

Case Study Details

In the era of all-things interconnected, consumer demand for personalized information has witnessed explosive growth and the rate of enterprise digitalization continues to rise. The sustained uptake of new technology, including cloud computing and virtualization, has led to the increasing influence and role of information technology and the information industry in economic and social development.

As a world-leading supplier of information and communication technology solutions, the ICT sector has been a major focus point for Huawei in recent times. Huawei has been steadily developing their operations, innovation, and cooperation to build end-to-end solutions with a competitive edge in telecommunications, enterprise usage, terminals, and cloud computing. Huawei 2012 Laboratories is the company’s leading internal R&D institute. The lab shoulders the responsibility and mission to strengthen Huawei's technological research and ensure long-term product development. The prime focus for Huawei 2012 Laboratories is to provide customers with innovative, reliable, and high-performance products and solutions.

As one of their core partners, TE Connectivity (TE) maintains a close partnership with Huawei providing numerous varieties of flexible interconnected solutions for Huawei products and has developed a strong working relationship. Building on the recognition of TE's world-leading connectivity technology and years of cooperation, Huawei 2012 Laboratories selected to partner with TE to develop the microQSFP interconnect system for the next generation of mass communication device products. The new system not only satisfies Huawei's requirements for high-density, high-speed transmission, signal integrity, and cooling performance but also assists Huawei to demonstrate prototype product versions to customers within a specified period of time and thereby secure customer orders.

Since the start of its development, the high-density feature of microQSFP has attracted close attention from Huawei 2012 Laboratories. microQSFP enables pluggable solutions with all the functionality of QSFP28/56 in the same faceplate density as SFP (a single channel solution) that fit more ports (up to 72) on a standard line card. In order to ensure that our solution enables clean signal for the entire channel at a low cost, our team tuned the design to enable 3-high (stacked connectors belly to belly with smt connects) routing in only 6 layers. In the end, our work achieved high density 56Gbps PAM-4 performance in an easy, low cost implementation.  The innovative integrated module thermal solution on these products has better thermal performance while performing higher power handling capability. Moreover, based on new EMI management techniques, we were able to achieve improvement in EMI.

TE has been heavily involved in the research and design behind microQSFP’s three major advantages in signal integrity, thermal performance, and EMI shielding. TE’s ability to provide a 0.6mm port spacing to improve density, while maintaining excellent signal integrity of Huawei products, improving thermal performance, and simplifying the thermal design of the system have all contributed to gaining the trust of Huawei 2012 Laboratories. Through this process, Huawei has praised the TE team for its in-depth and positive cooperation towards product development.

What’s even more exciting is that as a leading enterprise in the microQSFP MSA, TE has provided forward-looking technical guidance for Huawei 2012 Laboratories and their product development. Thereby assisting Huawei 2012 Laboratories to develop more products that meet the needs of future technology development and win market opportunities.

“We have conducted several rounds of research and tests while working closely with TE, during which microQSFP delivered excellent high-speed transmission, SI, EMI and thermal performances. It provides the right combination of features for our next-generation high-density I/O interfaces, showcasing TE’s strong design and engineering capabilities,” said Fang Wei, Chief Cable and Connector Expert, Huawei 2012 Laboratories. “This project has allowed us to further our understanding of the TE team’s technical strengths and service ability. We look forward even more excellent results from TE in the future!”

Learn More:  www.TE.com/microQSFP

 

MusicLinear

Case Study

TE’s microQSFP Enables Huawei’s Next-Gen High Density I/O Needs

A Partnership with Huawei 2012 Laboratories

Case Study Details

In the era of all-things interconnected, consumer demand for personalized information has witnessed explosive growth and the rate of enterprise digitalization continues to rise. The sustained uptake of new technology, including cloud computing and virtualization, has led to the increasing influence and role of information technology and the information industry in economic and social development.

As a world-leading supplier of information and communication technology solutions, the ICT sector has been a major focus point for Huawei in recent times. Huawei has been steadily developing their operations, innovation, and cooperation to build end-to-end solutions with a competitive edge in telecommunications, enterprise usage, terminals, and cloud computing. Huawei 2012 Laboratories is the company’s leading internal R&D institute. The lab shoulders the responsibility and mission to strengthen Huawei's technological research and ensure long-term product development. The prime focus for Huawei 2012 Laboratories is to provide customers with innovative, reliable, and high-performance products and solutions.

As one of their core partners, TE Connectivity (TE) maintains a close partnership with Huawei providing numerous varieties of flexible interconnected solutions for Huawei products and has developed a strong working relationship. Building on the recognition of TE's world-leading connectivity technology and years of cooperation, Huawei 2012 Laboratories selected to partner with TE to develop the microQSFP interconnect system for the next generation of mass communication device products. The new system not only satisfies Huawei's requirements for high-density, high-speed transmission, signal integrity, and cooling performance but also assists Huawei to demonstrate prototype product versions to customers within a specified period of time and thereby secure customer orders.

Since the start of its development, the high-density feature of microQSFP has attracted close attention from Huawei 2012 Laboratories. microQSFP enables pluggable solutions with all the functionality of QSFP28/56 in the same faceplate density as SFP (a single channel solution) that fit more ports (up to 72) on a standard line card. In order to ensure that our solution enables clean signal for the entire channel at a low cost, our team tuned the design to enable 3-high (stacked connectors belly to belly with smt connects) routing in only 6 layers. In the end, our work achieved high density 56Gbps PAM-4 performance in an easy, low cost implementation.  The innovative integrated module thermal solution on these products has better thermal performance while performing higher power handling capability. Moreover, based on new EMI management techniques, we were able to achieve improvement in EMI.

TE has been heavily involved in the research and design behind microQSFP’s three major advantages in signal integrity, thermal performance, and EMI shielding. TE’s ability to provide a 0.6mm port spacing to improve density, while maintaining excellent signal integrity of Huawei products, improving thermal performance, and simplifying the thermal design of the system have all contributed to gaining the trust of Huawei 2012 Laboratories. Through this process, Huawei has praised the TE team for its in-depth and positive cooperation towards product development.

What’s even more exciting is that as a leading enterprise in the microQSFP MSA, TE has provided forward-looking technical guidance for Huawei 2012 Laboratories and their product development. Thereby assisting Huawei 2012 Laboratories to develop more products that meet the needs of future technology development and win market opportunities.

“We have conducted several rounds of research and tests while working closely with TE, during which microQSFP delivered excellent high-speed transmission, SI, EMI and thermal performances. It provides the right combination of features for our next-generation high-density I/O interfaces, showcasing TE’s strong design and engineering capabilities,” said Fang Wei, Chief Cable and Connector Expert, Huawei 2012 Laboratories. “This project has allowed us to further our understanding of the TE team’s technical strengths and service ability. We look forward even more excellent results from TE in the future!”

Learn More:  www.TE.com/microQSFP