Story
BBU and Optical Transport Connectors

Application

ENABLING FRONTHAUL TO BACKHAUL AND BEYOND

Our base station and optical transport connectivity solutions address the demands of the always-on edge of expanding wireless infrastructure.

Along with increased capacity demands driven by the explosion of cloud and connected device growth, engineers need interconnects that enhance the design, implementation and maintenance of networks from the access point to the core. Our innovations in connectivity technologies push the boundaries of speed and bandwidth within today’s architectures and address challenging data rate, signal and power requirements of the emerging 5G mobile networks. TE’s solutions also include antenna expertise and high-speed board-to-board as well as cabled interconnects offering increased bandwidth for backplanes and midplanes.

Related Materials
BBU and Optical Transport Connectors

Trend

ENABLING FRONTHAUL TO BACKHAUL AND BEYOND

Our base station and optical transport connectivity solutions address the demands of the always-on edge of expanding wireless infrastructure.

Along with increased capacity demands driven by the explosion of cloud and connected device growth, engineers need interconnects that enhance the design, implementation and maintenance of networks from the access point to the core. Our innovations in connectivity technologies push the boundaries of speed and bandwidth within today’s architectures and address challenging data rate, signal and power requirements of the emerging 5G mobile networks. TE’s solutions also include antenna expertise and high-speed board-to-board as well as cabled interconnects offering increased bandwidth for backplanes and midplanes.

1-2201197-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Pitch
  • Connector Type Connector Assembly
  • Profile Low
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 10
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 250
  • Insulation Resistance 10
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 250
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .1
  • Contact Type Socket
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Centerline (Pitch) .4
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Entry Style Top
  • Stack Height .98
  • Height .98
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
1-2201196-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Pitch
  • Connector Type Connector Assembly
  • Profile Low
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 10
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 250
  • Insulation Resistance 10
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 250
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .1
  • Contact Type Tab
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Centerline (Pitch) .4
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Entry Style Top
  • Stack Height .98
  • Height .76
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
2-2201196-4 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Pitch
  • Connector Type Connector Assembly
  • Profile Low
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 250
  • Insulation Resistance 24
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 250
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Centerline (Pitch) .4
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Entry Style Top
  • Stack Height .98
  • Height .76
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
3-2201196-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Pitch
  • Connector Type Connector Assembly
  • Profile Low
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 250
  • Insulation Resistance 30
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 250
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) .3
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Centerline (Pitch) .4
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Entry Style Top
  • Stack Height .98
  • Height .76
  • Operating Temperature Range -40 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000