TE's zQSFP+ interconnects offer an increased data rate of 28 Gbps NRZ and 56 Gbps PAM-4.
TE's C form factor pluggable (CFP) interconnects are for high speed transfer of Ethernet and other protocols in high performance applications like carrier networks, data centers, and wireless equipment.
TE’s zSFP+ interconnects offer an increased data rate of 28 Gbps NRZ and 56 Gbps PAM-4.
TE's OSFP connectors integrate thermal management directly into the form factor, eliminating high thermal resistance between the module and heat sink.
TE's STRADA Whisper connectors operate with extremely low noise, low insertion loss and little to no skew—all of which provide system architects with design flexibility and high design margin.
We are at the forefront of data center connectivity, creating a broad, innovative portfolio for enterprise and hyperscale applications. Our cutting-edge solutions anticipate today’s big data needs – and account for tomorrow’s forward-looking designs. We don’t just follow industry standards; we create them. By developing products that are smaller, faster, and more agile, we meet growing design needs for the next generation of data centers. We have big ideas – and these big ideas translate to lasting solutions for a growing market.Contact Us
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