TE Connectivity Rounds Out LGA 3647 Socket Product Line. Socket and Hardware Solutions Support Intel’s Latest CPU Processors
March 08, 2017
Harrisburg, Pa. – TE Connectivity (TE), a world leader in connectivity and sensors, announced today that its complete LGA 3647 Socket and hardware product line solutions are now available. These products are designed for Intel Corporation’s new processors specified under their new server platforms. TE’s LGA sockets and hardware together provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). The LGA 3647 socket is the first LGA socket to feature a two-piece design for the larger processor that improves issues with warpage and offers better coplanarity and reliability in connectivity for large processors.
TE’s LGA 3647 product line includes:
- The LGA 3647 Socket P0 and Socket P1, which are compatible with Intel’s latest processors
- A Clip/Carrier, which provides better alignment and keeps fingers away from the socket contact field
- A Bolster Plate, which provides orientation and alignment for PHM and the spring load force necessary for socket loading
- A Back Plate, which provides mounting points for the bolster plate assembly
TE Connectivity Ltd. (NYSE: TEL) is a $14 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS.