OCP Summit 2018

Industry Tradeshow

OCP Summit 2018

March 20-21, 2018

San Jose Convention Center

San Jose, CA

Booth #B23

As a member of the Open Compute Project (OCP) community, we are a technology-driven ecosystem partner dedicated to delivering high-performance and high-power solutions to our customers that provide design flexibility and potential cost savings. Our innovative portfolio of power, input/output (I/O), board-to-board and socket products are available now to take your design to the next level with performance you can trust. 

We are an established supplier of next generation I/O connectors and copper cable solutions addressing data rates up to 400 Gbps and enabling 25 Terabytes per 1RU density. 

OCP storage requirements demand solutions such as our sliding power connector and Sliver internal cabled interconnects, which feature a connector that has been adopted as an SSD drive receptacle. In addition, we provide OCP building blocks such as the open rack busbar and shelf power delivery systems. We have been an active OCP community member since its inception, providing optimized solutions to OCP members and enabling next generation high performance, globally available interconnect solutions. 

 

Featured Product Displays

  • Our new 48V power connectors and cable assemblies for Open Compute Project reduce cost through lower power consumption and simple design.
  • Sliver Card Edge Connectors and Internal Cable Assemblies enable your next generation designs to address your packaging and high-speed obstacles. 
  • STRADA Whisper Two Piece Board to Board Card Edge Connectors and Cable Assemblies are an industry leading, next- generation interface that supports traditional, orthogonal and cabled backplane applications with future friendly data rate capabilities while addressing density requirements. 
  • QSFP-DD, OSFP, Copper Cables and microQSFP high-speed I/O solutions with demonstrations on thermal performance, RU faceplate density and data throughput capabilities.

 

  1. Sliver Internal Cabled Interconnects (English)

Designed to be one of the most flexible solutions on the market for making internal I/O connections on the board, TE’s Sliver product portfolio is a robust connector and cable assembly system that helps extend the reach for high data signals inside networking equipment from the microprocessors to other locations while maintaining optimal signal integrity.

  1. The Innovation Behind microQSFP (English)

Watch now to learn more about microQSFP.

OCP Summit 2018

Industry Tradeshow

OCP Summit 2018

March 20-21, 2018

San Jose Convention Center

San Jose, CA

Booth #B23

As a member of the Open Compute Project (OCP) community, we are a technology-driven ecosystem partner dedicated to delivering high-performance and high-power solutions to our customers that provide design flexibility and potential cost savings. Our innovative portfolio of power, input/output (I/O), board-to-board and socket products are available now to take your design to the next level with performance you can trust. 

We are an established supplier of next generation I/O connectors and copper cable solutions addressing data rates up to 400 Gbps and enabling 25 Terabytes per 1RU density. 

OCP storage requirements demand solutions such as our sliding power connector and Sliver internal cabled interconnects, which feature a connector that has been adopted as an SSD drive receptacle. In addition, we provide OCP building blocks such as the open rack busbar and shelf power delivery systems. We have been an active OCP community member since its inception, providing optimized solutions to OCP members and enabling next generation high performance, globally available interconnect solutions. 

 

Featured Product Displays

  • Our new 48V power connectors and cable assemblies for Open Compute Project reduce cost through lower power consumption and simple design.
  • Sliver Card Edge Connectors and Internal Cable Assemblies enable your next generation designs to address your packaging and high-speed obstacles. 
  • STRADA Whisper Two Piece Board to Board Card Edge Connectors and Cable Assemblies are an industry leading, next- generation interface that supports traditional, orthogonal and cabled backplane applications with future friendly data rate capabilities while addressing density requirements. 
  • QSFP-DD, OSFP, Copper Cables and microQSFP high-speed I/O solutions with demonstrations on thermal performance, RU faceplate density and data throughput capabilities.

 

  1. Sliver Internal Cabled Interconnects (English)

Designed to be one of the most flexible solutions on the market for making internal I/O connections on the board, TE’s Sliver product portfolio is a robust connector and cable assembly system that helps extend the reach for high data signals inside networking equipment from the microprocessors to other locations while maintaining optimal signal integrity.

  1. The Innovation Behind microQSFP (English)

Watch now to learn more about microQSFP.