connected aircraft

Industry Tradeshow

SINGAPORE AIR SHOW 2018

Enabling the Connected Aircraft
Interconnect Solutions for Military and Commercial Aerospace

February 6-9, 2018

Changi Exhibition Centre - Singapore
Booth #B24

Designing the Connected Aircraft for Smarter, Faster Connectivity. Today’s aircrafts are more connected than ever before to make flight more efficient and safer. Pilots and ground crews require more information at faster speeds to manage increasingly complex aircraft systems. To meet these demands, TE Connectivity (TE) has developed technologies that provide reliable performance in harsh environments to make modern air travel faster, more efficient and enjoyable.

Work with TE to solve tough connectivity and packaging configuration challenges. By partnering with your design team early in the design review process, together we'll align the full power of TE subject matter expertise to your project goals. Take advantage of our broad, cross-industry knowledge and innovation.

  1. MiniMRP Avionics Packaging

MiniMRP Avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs.

  1. Enter the World of Sensors (English)

Sensors enhance our capacity to observe and report on the world around us. What a sensor sees can be the difference between that which is imagined and that which is possible.

connected aircraft

Industry Tradeshow

SINGAPORE AIR SHOW 2018

Enabling the Connected Aircraft
Interconnect Solutions for Military and Commercial Aerospace

February 6-9, 2018

Changi Exhibition Centre - Singapore
Booth #B24

Designing the Connected Aircraft for Smarter, Faster Connectivity. Today’s aircrafts are more connected than ever before to make flight more efficient and safer. Pilots and ground crews require more information at faster speeds to manage increasingly complex aircraft systems. To meet these demands, TE Connectivity (TE) has developed technologies that provide reliable performance in harsh environments to make modern air travel faster, more efficient and enjoyable.

Work with TE to solve tough connectivity and packaging configuration challenges. By partnering with your design team early in the design review process, together we'll align the full power of TE subject matter expertise to your project goals. Take advantage of our broad, cross-industry knowledge and innovation.

  1. MiniMRP Avionics Packaging

MiniMRP Avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs.

  1. Enter the World of Sensors (English)

Sensors enhance our capacity to observe and report on the world around us. What a sensor sees can be the difference between that which is imagined and that which is possible.