DesignCon 2019

Industry Tradeshow

DesignCon 2019

January 30, 2019 - January 31, 2019

January 30, 2019

 

Santa Clara Convention Center
Santa Clara, CA

Booth 817

 

Visit TE at Booth# 817 to explore our data center portfolio and discover the many ways our products can help empower your innovations. TE’s portfolio of advanced, reliable connectors and other components offer solutions for speed, density, power and connectivity and are driving the next generation of data center applications. 

See below for a sneak peak of what to expect in our demonstrations highlighting performance and next-generation solutions for data centers and the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that you need for your next project.

Featured 2019 Products

  • OSFP, QSFP-DD, QSFP, SFP-DD and  high-speed I/O solutions showcasing solutions for disaggregation, density, improved channels, thermal management, co-packaging, and power delivery.
  • The Sliver Interconnect Family has been identified as the standard and required product through several industry groups like COBO, GenZ, EDSFF and Open Compute for today and next gen server and storage designs.  

 

5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world.

  1. Sliver Internal Cabled Interconnects (English)

Designed to be one of the most flexible solutions on the market for making internal I/O connections on the board, TE’s Sliver product portfolio is a robust connector and cable assembly system that helps extend the reach for high data signals inside networking equipment from the microprocessors to other locations while maintaining optimal signal integrity.

  • 5G and the Future of Connectivity

  • LGA 3647 Socket and Hardware (English)

  • STRADA Whisper DPO Connectors (English)

We will showcase solid engineering of industry standard interfaces with innovative thermal and power management solutions, meeting the challenges of increasing density and speed in the data center.
Erin Byrne,
Vice President, Engineering and CTO | Data & Devices
DesignCon 2019

Industry Tradeshow

DesignCon 2019

January 30, 2019 - January 31, 2019

January 30, 2019

 

Santa Clara Convention Center
Santa Clara, CA

Booth 817

 

Visit TE at Booth# 817 to explore our data center portfolio and discover the many ways our products can help empower your innovations. TE’s portfolio of advanced, reliable connectors and other components offer solutions for speed, density, power and connectivity and are driving the next generation of data center applications. 

See below for a sneak peak of what to expect in our demonstrations highlighting performance and next-generation solutions for data centers and the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that you need for your next project.

Featured 2019 Products

  • OSFP, QSFP-DD, QSFP, SFP-DD and  high-speed I/O solutions showcasing solutions for disaggregation, density, improved channels, thermal management, co-packaging, and power delivery.
  • The Sliver Interconnect Family has been identified as the standard and required product through several industry groups like COBO, GenZ, EDSFF and Open Compute for today and next gen server and storage designs.  

 

5G networks will accelerate data up to 100 times faster than today's technology. This will require advanced connectivity for broader bandwidth and high-clarity communications. Increased data speeds in the future will enable an interactive ecosystem for a smarter, productive, and connected world.

  1. Sliver Internal Cabled Interconnects (English)

Designed to be one of the most flexible solutions on the market for making internal I/O connections on the board, TE’s Sliver product portfolio is a robust connector and cable assembly system that helps extend the reach for high data signals inside networking equipment from the microprocessors to other locations while maintaining optimal signal integrity.

  • 5G and the Future of Connectivity

  • LGA 3647 Socket and Hardware (English)

  • STRADA Whisper DPO Connectors (English)

We will showcase solid engineering of industry standard interfaces with innovative thermal and power management solutions, meeting the challenges of increasing density and speed in the data center.
Erin Byrne,
Vice President, Engineering and CTO | Data & Devices