TE's next generation LGA 3647 socket solution provides increased reliability for the latest Intel CPU processors.
With the addition of DDR4 DIMM sockets, TE continues to offer a comprehensive socket portfolio to our customers with industry-leading engineering support, service and product availability.
TE's Sliver interconnects simplify design and help lower overall costs by eliminating the need for re-timers and more costly lower-loss PCB materials while reaching speeds up to 25 Gbps with the use of TE high speed cable.
TE's MULTI-BEAM card edge connectors deliver the best overall power and signal density to address server market requirements for performance, profile and cost.
TE's ELCON Mini connectors features a small, 8mm height form-factor and support higher current than similar sized solutions – up to 40 amps per contact, and rated for 400 volts AC or DC.
We are at the forefront of data center connectivity, creating a broad, innovative portfolio for enterprise and hyperscale applications. Our cutting-edge solutions anticipate today’s big data needs – and account for tomorrow’s forward-looking designs. We don’t just follow industry standards; we create them. By developing products that are smaller, faster, and more agile, we meet growing design needs for the next generation of data centers. We have big ideas – and these big ideas translate to lasting solutions for a growing market.Contact Us
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