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  • Overview

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DDR3 DIMM Sockets

DDR3 DIMM Sockets-CAT-D3303-SO1399
DDR3 DIMM Sockets are designed to JEDEC industry standards. They are available with vertical and right angle orientations and through hole and surface mount configurations. DDR3 DIMM Socket applications include servers, notebook PCs, and communications equipment.
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Product Features

  • DRAM Type: Double Data Rate (DDR) 3

  • Connector System: Board-to-Board

  • Number of Positions: 240

  • Termination Method to Printed Circuit Board: Through Hole - Solder

  • Module Orientation: Vertical

Available from

LADD Inc

Overview

Product Features

DDR3 Memory Sockets
  • Designed to accept standard JEDEC memory modules
  • Low resistance vertical through-hole socket available
  • SO DIMM's are offered in several stacking heights to maximize board space
  • Vertical through-hole sockets available in three tail lengths to accommodate most board thicknesses

168

Memory module pin count

The dual inline memory module (DIMM) is a memory module with 168 pins. DIMMs are commonly used today and support 64-bit transfer. They have been the predominant type of memory module since Intel P5-based Pentium processors began to gain market share.

Quick Reference Guide
DDR3 DIMM Sockets (English)

TE's DIMM sockets address interconnect requirements across server, communications, and notebook platforms. This product portfolio is designed around JEDEC industry standards. Sockets are offered with a variety of features designed to meet high speed data applications where peak performance is required.

Product Options

  • DDR3 DIMM Vertical Through Hole
  • DDR3 DIMM Vertical Surface Mount
  • DDR3 DIMM Right Angle Surface Mount
  • Mini DIMM Right Angle Surface Mount

Select Applications

DDR3 Memory Sockets
  • Notebook PC's
  • Desktop PC's
  • Communications equipment
  • Servers 

Application

Enhanced Ultraportables

Smaller devices require smaller components. TE’s low-profile solutions free up more space on a circuit board while delivering stability and power, allowing the smallest laptops to pack serious capability.

Product Group

SO DIMM Sockets

TE's memory sockets are designed for JEDEC SO DIMMs for the latest DDR2 and DDR3.

Product Group

DDR4 Memory Sockets

Our DDR4 sockets provide reliable connections to memory modules for servers, storage, communications equipment and desktop PCs, with up to 20% PCB space savings over DDR3 DIMM sockets.

Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Connector & Contact Terminates To  Printed Circuit Board

  • DRAM Type  Double Data Rate (DDR) 3

  • Connector System  Board-to-Board

Configuration Features

  • Number of Rows  2

  • Number of Positions  240

  • Module Orientation  Vertical

  • Number of Keys  1

  • Number of Bays  2

Electrical Characteristics

  • DRAM Voltage (V) 1.5

Body Features

  • Connector Profile  Standard

  • Ejector Type  Rotary, Standard

  • Module Key Type  Offset Left

  • Retention Post Location  Both Ends, Center

  • Latch Material  High Temperature Nylon, High Temperature Thermoplastic, Thermoplastic

  • Ejector Location  Both Ends

  • Latch Color  Black, Green, Natural

  • Ejector Material  High Temperature Nylon, High Temperature Thermoplastic, Thermoplastic

  • Ejector Material Color  Black, Green, Natural

  • PCB Retention Feature Material  Brass, Copper Alloy

Contact Features

  • Contact Base Material  Copper Alloy

  • PCB Contact Termination Area Plating Material  Tin

  • Contact Underplating Material  Nickel

  • Contact Mating Area Plating Material  Gold, Gold Flash

  • Contact Mating Area Plating Material Thickness (µm) .08, .38, .51, .76

  • Contact Mating Area Plating Material Thickness (µin) 3.14, 15, 20, 30

  • PCB Contact Termination Area Plating Material Thickness (µm) 2.54, 3

  • PCB Contact Termination Area Plating Material Thickness (µin) 100, 118.1

  • Contact Current Rating (Max) (A) .5, .75

  • Socket Style  DIMM

  • Memory Socket Type  Memory Card

Termination Features

  • Termination Post & Tail Length (mm) 2.67, 2.85, 3.18, 3.38, 4

  • Termination Post & Tail Length (in) .105, .112, .125, .133, .157

  • Termination Method to Printed Circuit Board  Surface Mount, Through Hole - Press-Fit, Through Hole - Solder

  • Insertion Style  Direct Insert

Mechanical Attachment

  • Connector Mounting Type  Board Mount

  • PCB Mount Retention Type  Boardlock, Retention Clip/Post, Solder Peg, Solder Tail

  • PCB Mount Retention  With

  • Mating Alignment  With, Without

  • Mating Alignment Type  Center, Offset Left

  • PCB Mount Alignment Type  Locating Posts

  • Mount Angle  Right Angle, Vertical

Housing Features

  • Housing Color  Black, Blue, Natural

  • Housing Material  High Temperature Nylon, Thermoplastic

  • Centerline (Pitch) (mm) 1, 2

  • Centerline (Pitch) (in) .03, .039, .07

Dimensions

  • Profile Height from PCB (mm) 21, 23.1

  • Profile Height from PCB (in) .82, .9, .91

  • Row-to-Row Spacing (mm) .95, 1.45, 1.9

  • Row-to-Row Spacing (in) .037, .05, .075

  • Center Retention Hole Diameter (mm) 1.8, 2.45

  • Center Retention Hole Diameter (in) .07, .096

Usage Conditions

  • Operating Temperature Range (°C) -55 – 105, -55 – 155, -55 – 85, -40 – 85

  • Operating Temperature Range (°F) -67 – 185, -67 – 221, -67 – 311, -40 – 185

Operation/Application

  • Circuit Application  Signal

Industry Standards

  • UL Flammability Rating  UL 94V-0

Packaging Features

  • Packaging Quantity  50, 54, 64, 480

  • Packaging Method  Box & Tray, Hard Tray, Tray

Reference Number

  • TE Internal Number CAT-D3303-SO1399

Related Materials

No documentation available.

JEDEC is a trademark of its respective owner.