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Data Centers & AI
Trend Insight
How to Increase Speed and Efficiency in Data Centers
Cloud computing and bandwidth-intensive applications have made the data center more important than ever.
As data center equipment speeds continue to increase, traditional FR4 printed circuit board (PCB) substrates may no longer provide acceptable transmission performance, especially at 25 Gbps and beyond. Learn more about TE Connectivity's high speed alternative solution to PCBs through cabled backplane systems.
Addressing the demands of today's data centers requires a new level of flexibility, scalability and agility in design, execution and operation.
TE's cutting-edge solutions can anticipate today’s big data needs – and account for tomorrow’s forward-looking designs.
From “Big Data” and the Internet of Things (IoT) to wearable devices, 4K television, and 5G wireless networks, market forces are driving the need to move more data faster than ever to more places.
Cloud computing and bandwidth-intensive applications have made the data center more important than ever, and managers want to squeeze every last bit of performance out of its architecture, even down to the connector level.
Learn about the crucial factors affecting machine learning performance, scalability, and resiliency in data center systems.
TE HDC empowers the data center operation efficiency with flexible and modular design, meeting customers’ requirements of sustainability.
From substations to data centers and energy storage – we are one source for multiple connectivity and sensor needs. We offer an extensive portfolio of reliable solutions to connect and protect your data center, even in the harshest conditions.
High-speed connectivity is driving innovation in data center design. Our mid-board copper solutions are engineered to enable this innovation.
Data centers have evolved into physical and virtual infrastructures. Many companies run hybrid clouds, a combination of both types of data centers.
