Products (31) Overview
microQSFP

The next generation of pluggable I/O interconnects

TE is leading the industry in the design of microQSFP interconnects which offer 33% increased density over QSFP connectors and significantly better thermal performance than other pluggable solutions.

micro quad small form-factor pluggable (microQSFP) interconnects provide zQSFP+ (QSFP28) functionality in a smaller, generally SFP-sized form-factor.  At 33% higher density than QSFP, microQSFP interconnects fit more ports (up to 72) on a standard line card, saving significant design space. The integrated module thermal solution on these products offers significantly better thermal performance than many other pluggable solutions on the market today, requiring less energy to cool equipment and allowing greater ease in system thermal design. 

Revolutionary Potential

microQSFP

The technological innovations of the microQSFP connectors and cages have the potential to revolutionize the future development of pluggable interconnects for next-generation designs. 

DENSE

Higher Density for Space Savings

COOL

Less Energy Needed for Cooling

FAST

56 Gbps performance with backwards compatibility to 28 Gbps

Key Benefits and Features

Higher Density Design Saves Space
  • 4x28G solution (QSFP28 functionality in a smaller, generally SFP-sized form-factor)
  • 33% higher density than QSFP
  • Up to 72 ports on a standard line card
  • 14.25mm port-to-port pitch
  • Routable, three-high, belly-to-belly faceplate architecture
  • Low-cost PCB design

Increased Thermal Performance Saves Energy Costs
  • Integrated module thermal solution offers significantly better thermal performance than QSFP28 solutions
  • Removed largest source of thermal resistance
  • Heat sink material can be changed based on power level of optical engine
  • Thermal performance does not suffer with highest density application
  • Connector requires less energy to cool equipment and increases ease of system thermal design
     
Standardized Form Factor Supports Next-Generation Designs
  • 56 Gbps performance with backwards compatibility to 28 Gbps
  • Multi-Source Agreement (MSA) group has defined the mechanical features of the plug, cage and receptacle to provide standard interface with multiple connector and cable assembly sources
  • Total data center functionality and broad market adoption on networking equipment expected to lead to higher volumes and lower costs
     
microQSFP Cable Assembly
microQSFP Cable Assembly
microQSFP Breakout Cable Assembly
microQSFP Breakout Cable Assembly
  1. The Innovation Behind microQSFP (English)

Watch now to learn more about microQSFP.

microQSFP Interconnects: 72 ports in 1 RU

microQSFP Interconnects: 72 ports in 1 RU

microQSFP

The next generation of pluggable I/O interconnects

TE is leading the industry in the design of microQSFP interconnects which offer 33% increased density over QSFP connectors and significantly better thermal performance than other pluggable solutions.

micro quad small form-factor pluggable (microQSFP) interconnects provide zQSFP+ (QSFP28) functionality in a smaller, generally SFP-sized form-factor.  At 33% higher density than QSFP, microQSFP interconnects fit more ports (up to 72) on a standard line card, saving significant design space. The integrated module thermal solution on these products offers significantly better thermal performance than many other pluggable solutions on the market today, requiring less energy to cool equipment and allowing greater ease in system thermal design. 

Revolutionary Potential

microQSFP

The technological innovations of the microQSFP connectors and cages have the potential to revolutionize the future development of pluggable interconnects for next-generation designs. 

DENSE

Higher Density for Space Savings

COOL

Less Energy Needed for Cooling

FAST

56 Gbps performance with backwards compatibility to 28 Gbps

Key Benefits and Features

Higher Density Design Saves Space
  • 4x28G solution (QSFP28 functionality in a smaller, generally SFP-sized form-factor)
  • 33% higher density than QSFP
  • Up to 72 ports on a standard line card
  • 14.25mm port-to-port pitch
  • Routable, three-high, belly-to-belly faceplate architecture
  • Low-cost PCB design

Increased Thermal Performance Saves Energy Costs
  • Integrated module thermal solution offers significantly better thermal performance than QSFP28 solutions
  • Removed largest source of thermal resistance
  • Heat sink material can be changed based on power level of optical engine
  • Thermal performance does not suffer with highest density application
  • Connector requires less energy to cool equipment and increases ease of system thermal design
     
Standardized Form Factor Supports Next-Generation Designs
  • 56 Gbps performance with backwards compatibility to 28 Gbps
  • Multi-Source Agreement (MSA) group has defined the mechanical features of the plug, cage and receptacle to provide standard interface with multiple connector and cable assembly sources
  • Total data center functionality and broad market adoption on networking equipment expected to lead to higher volumes and lower costs
     
microQSFP Cable Assembly
microQSFP Cable Assembly
microQSFP Breakout Cable Assembly
microQSFP Breakout Cable Assembly
  1. The Innovation Behind microQSFP (English)

Watch now to learn more about microQSFP.

microQSFP Interconnects: 72 ports in 1 RU

microQSFP Interconnects: 72 ports in 1 RU