CDFP, OSFP, QSFP-DD and COBO form factors support the emerging Ethernet standard
Today’s 400 Gigabit Ethernet (400GbE) module form factors offer the flexibility to satisfy various needs and environments across the Ethernet ecosystem and are targeted for massive aggregation of data across an array of applications. TE is at the forefront of developing these solutions with industry leaders to bring our customers the fastest speeds combined with the best performance.
With 16 channels of up to 28 Gbps data rates for 400 Gbps total bandwidth, CDFP connectors, cages and cable assemblies can easily handle the market’s increasing data usage. The simple one-piece, press-fit pluggable I/O assembly provides the flexibility and standardization to address your design needs and is perfect for high speed networking and high performance computing applications. We also offer copper CDFP cable assemblies that can be customized.
Designed to use eight electrical lanes to deliver 400GbE, OSFP is aimed at the upcoming generation of equipment that will operate with 50 Gbps electrical signaling. OSFP integrates thermal management directly into the form factor, eliminating the high thermal resistance between the module and the heat sink. The airflow design allows for cooling the downstream silicon switch or compute chips inside the equipment enclosure.
QSFP-DD doubles the density of QSFP and eight differential pairs capable of 50 Gbps each to achieve 400GbE while allowing existing QSFP modules to be plugged into the same cage. The QSFP-DD specification provides both single-height and stacked configurations of the cage/connector system, supporting QSFP modules and QSFP-DD modules through an additional recessed row of contacts.
Named for the Consortium for On-Board Optics, the COBO form factor strives to facilitate higher modules port density, improved thermal management and better power efficiency. The COBO form factor holds potential key benefits for the new cloud market. COBO is developing both 400 Gbps and 2x400 Gbps capable footprints and aims to support an eight-wide electrical interface for 400GbE intended for a similar array of optical interfaces.