Products (5)
1-2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.2
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness .05
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.2
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness .05
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2199325-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • PCB Mounting Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 24
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2291283-2 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
2291283-1 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Board
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
Overview
0.5mm Fine Pitch Hermaphroditic (FPH) Connectors

HERMAPHRODITIC DESIGN SIMPLIFIES INVENTORY MANAGEMENT

0.5mm fine pitch board-to-board connectors feature a hermaphroditic design that mates to itself, reducing inventory product mix with consolidated part numbers and components.

In addition to simplifying inventory management, the hermaphroditic design of these connectors can help save time and costs associated with qualifying new parts. Instead of a header part and a receptacle part for each connection, there is only one part number to qualify.  0.5mm FPH connectors help ensure more secure connections with features including dual point contacts for more reliability and guidance posts for easier mating.

“Mates with itself” design
“Mates with itself” design
Dual point contacts. High unmating force
Dual point contacts. High unmating force
Guidance posts for easy mating
Guidance posts for easy mating

Benefits

  • Hermaphroditic design reduces inventory product mix with consolidated part numbers and components
  • Help save time and costs associated with qualifying new parts
  • Support up to 8 Gbps data rates
  • Operating temperature of -40C to +125C allow these connectors to perform reliably in demanding environments
  • Stub-less contact interface support PCIe Gen 3 compatibility
  • Housing are available in UL 94V-0 flammability-rated LCP material
  • Dual point contact design provides better precision and reliability
  • Four guidance posts help ensure easy mating, even when there is mis-alignment

Applications

  • Point-of-Sale (POS) Devices
  • Retail equipment
  • Networking
  • Data and mass storage
  • Instrumentation
  • Industrial controls
  • Medical equipment
  • Military equipment
  • Automotive
POS Devices
POS Devices
Industrial Controls
Industrial Controls
Medical Equipment
Medical Equipment
Networking
Networking
0.5mm Fine Pitch Hermaphroditic (FPH) Connectors

HERMAPHRODITIC DESIGN SIMPLIFIES INVENTORY MANAGEMENT

0.5mm fine pitch board-to-board connectors feature a hermaphroditic design that mates to itself, reducing inventory product mix with consolidated part numbers and components.

In addition to simplifying inventory management, the hermaphroditic design of these connectors can help save time and costs associated with qualifying new parts. Instead of a header part and a receptacle part for each connection, there is only one part number to qualify.  0.5mm FPH connectors help ensure more secure connections with features including dual point contacts for more reliability and guidance posts for easier mating.

“Mates with itself” design
“Mates with itself” design
Dual point contacts. High unmating force
Dual point contacts. High unmating force
Guidance posts for easy mating
Guidance posts for easy mating

Benefits

  • Hermaphroditic design reduces inventory product mix with consolidated part numbers and components
  • Help save time and costs associated with qualifying new parts
  • Support up to 8 Gbps data rates
  • Operating temperature of -40C to +125C allow these connectors to perform reliably in demanding environments
  • Stub-less contact interface support PCIe Gen 3 compatibility
  • Housing are available in UL 94V-0 flammability-rated LCP material
  • Dual point contact design provides better precision and reliability
  • Four guidance posts help ensure easy mating, even when there is mis-alignment

Applications

  • Point-of-Sale (POS) Devices
  • Retail equipment
  • Networking
  • Data and mass storage
  • Instrumentation
  • Industrial controls
  • Medical equipment
  • Military equipment
  • Automotive
POS Devices
POS Devices
Industrial Controls
Industrial Controls
Medical Equipment
Medical Equipment
Networking
Networking
1-2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.2
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness .05
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.2
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness .05
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2199325-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • PCB Mounting Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 24
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2291283-2 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
2291283-1 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Board
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel