0.5mm Fine Pitch Hermaphroditic (FPH) Connectors

HERMAPHRODITIC DESIGN SIMPLIFIES INVENTORY MANAGEMENT

0.5mm fine pitch board-to-board connectors feature a hermaphroditic design that mates to itself, reducing inventory product mix with consolidated part numbers and components. Instead of a header part and a receptacle part for each connection, there is only one part number to qualify. 0.5mm FPH connectors help ensure more secure connections with features including dual point contacts for more reliability and guidance posts for easier mating.

Product Features

0.5mm FPH Connectors
  • Hermaphroditic design reduces inventory product mix with consolidated part numbers and components
  • Help save time and costs associated with qualifying new parts
  • Support up to 8 Gbps data rates
  • Operating temperature of -40C to +125C allow these connectors to perform reliably in demanding environments
  • Stub-less contact interface support PCIe Gen 3 compatibility
  • Housing are available in UL 94V-0 flammability-rated LCP material
  • Dual point contact design provides better precision and reliability
  • Four guidance posts help ensure easy mating, even when there is mis-alignment
“Mates with itself” design
“Mates with itself” design
Dual point contacts. High unmating force
Dual point contacts. High unmating force
Guidance posts for easy mating
Guidance posts for easy mating
1-2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Row-to-Row Spacing 3.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type None
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Row-to-Row Spacing 3.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type None
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type None
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2199325-4 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 24
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) .5
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2291283-2 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
2291283-1 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Hermaphroditic Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Type Hermaphroditic
  • Contact Current Rating (Max) .5
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel