High Density BGA Sockets
Our ball grid array (BGA) matrix series sockets using HXC125 technology are valuable for prototyping and development. The sockets are fully arrayed matrices of contacts, available on 0.80mm, 1.00mm, and 1.27mm pitches.
The solderless, compression-mount HXC125 contact system allows you to test a BGA device without attaching it directly to the board. The HXC125 technology provides electrically transparent signal transfer. The design of the BGA socket uses an anti-overstress feature to protect the contact and provide a well for the ball to rest in. This well acts as an alignment feature to center the BGA ball to the socket contact. Corner frames provide for gross alignment of the package to the socket. Custom arrays are available. The HXC125 socket provides a compression-mount, solderless interconnect . A hardware system is required to generate the necessary forces on the contacts. TE offers a broad hardware solution for each socket size.
Max I/O to Pitch
BGA Matrix Series Sockets
|Pitch (mm)||Max I/O|
This product brochure offers BGA assembly instructions and hardware tables for 0.80mm, 1.00mm, and 1.27mm pitch socket sizes.