PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 6
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 12
- Number of Positions 240
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe Yes
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes No
- Connector System Cable-to-Board
- Sealable Yes
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 4
- Number of Ports 8
- Number of Positions 160
- Data Rate (Max) 32
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ Cable Assembly
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe No
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly
- Cage Type Single
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 1
- Number of Ports 1
- Data Rate (Max) 32
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Tail Length 3
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- Packaging Method Tray
- EMI Containment Feature Type EMI Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 4
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 8
- Number of Positions 160
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
SFF-8083
SFF-8432
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 2
- Lightpipe Configuration Three
- Lightpipe Style Standard
- Number of Ports 4
- Number of Positions 80
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application SFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Cable Assembly Category High Speed
- Cable Assembly Type Pluggable / Direct Attach
- Shielded Yes
- Connector Type (End A) QSFP28
- Connector Type (End B) SFP28
- Cable Style Madison TurboTwin - Round Jacketed
- Product Type Cable Assembly
- Number of Positions 8-Pair
- Number of Signal Positions 16
- Keyed No
- Impedance 100
- Data Rate 25
- Equalized No
- Color Black
- Wire Size 30
- Wire Size .05
- Overall Outside Cable Diameter 4.57 mm
- Halogen Free Yes
- Flammability Rating CL2
- Cable Assembly Length 3
PRODUCT
active
SFF-8083
SFF-8432
- Form Factor zSFP+
- Product Type Cage Assembly
- Cage Type Ganged
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 2
- Number of Ports 2
- Data Rate (Max) 32
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Tail Length 2.05
- PCB Thickness (Recommended) 2.25
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable Yes
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 4
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 8
- Number of Positions 160
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe Yes
PRODUCT
active
- Form Factor zSFP+
- Product Type Connector
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Number of Positions 20
- Data Rate (Max) 32
- Contact Current Rating (Max) .5
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Termination Method to PC Board Surface Mount
- PCB Mounting Style Surface Mount
- Connector Mounting Type Board Mount
- Centerline (Pitch) .8
- Operating Temperature Range -55 – 85
- Application SFP+
- Circuit Application Power & Signal
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Reel
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 6
- Lightpipe Configuration Dual Triangular (Inner)
- Lightpipe Style Standard
- Number of Ports 12
- Number of Positions 240
- Data Rate (Max) 32
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 6
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 12
- Number of Positions 240
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Cable Assembly Category High Speed
- Cable Assembly Type Pluggable / Direct Attach
- Shielded Yes
- Connector Type (End A) QSFP28
- Connector Type (End B) SFP28
- Cable Style Madison TurboTwin - Round Jacketed
- Product Type Cable Assembly
- Number of Positions 8-Pair
- Number of Signal Positions 16
- Keyed No
- Impedance 100
- Data Rate 25
- Equalized No
- Color Black
- Wire Size 30
- Wire Size .05
- Overall Outside Cable Diameter 4.57 mm
- Halogen Free Yes
- Flammability Rating CL2
- Cable Assembly Length 2
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly
- Cage Type Single
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 1
- Number of Ports 1
- Data Rate (Max) 32
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Tail Length 3
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- Packaging Method Tray
- EMI Containment Feature Type EMI Springs
- Included Lightpipe No
PRODUCT
active
- Form Factor zSFP+
- Product Type Connector
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Number of Positions 20
- Data Rate (Max) 32
- Contact Current Rating (Max) .5
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Termination Method to PC Board Surface Mount
- PCB Mounting Style Surface Mount
- Connector Mounting Type Board Mount
- Centerline (Pitch) .8
- Operating Temperature Range -55 – 85
- Application SFP+
- Circuit Application Power & Signal
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Reel
PRODUCT
active
SFF-8083
SFF-8432
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 1
- Lightpipe Configuration Three
- Lightpipe Style Standard
- Number of Ports 2
- Number of Positions 40
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe Yes
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 1
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 2
- Number of Positions 40
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application zSFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe Yes
PRODUCT
active
- Form Factor zSFP+
- Product Type Cage Assembly with Integrated Connector
- Cage Type Stacked
- Included Heat Sink No
- Integrated Lightpipes Yes
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 2 x 2
- Lightpipe Configuration Quad Triangular (Inner & Outer)
- Lightpipe Style Standard
- Number of Ports 4
- Number of Positions 80
- Data Rate (Max) 32
- Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
- Tail Plating Material Tin
- Contact Mating Area Plating Thickness .76
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Centerline (Pitch) .8
- Tail Length 1.8
- PCB Thickness (Recommended) 1.5
- Operating Temperature Range -55 – 105
- Application SFP+ Thermally Enhanced
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- UL Flammability Rating UL 94V-0
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe Yes
PRODUCT
active
SFF-8083
SFF-8432
- Form Factor zSFP+
- Product Type Cage Assembly
- Cage Type Ganged
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable Yes
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 2
- Number of Ports 2
- Data Rate (Max) 32
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Tail Length 2.05
- PCB Thickness (Recommended) 3
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe No
PRODUCT
active
SFF-8083
SFF-8432
- Form Factor zSFP+
- Product Type Cage Assembly
- Cage Type Ganged
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable Yes
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 4
- Number of Ports 4
- Data Rate (Max) 32
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Cage Material Nickel Silver Alloy
- Tail Length 2.05
- PCB Thickness (Recommended) 3
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- Packaging Method Tray
- EMI Containment Feature Type Elastomeric Gasket
- Included Lightpipe No
PRODUCT
active
SFF-8083
SFF-8432
- Form Factor zSFP+
- Product Type Cage Assembly
- Cage Type Ganged
- Included Heat Sink No
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Port Matrix Configuration 1 x 4
- Number of Ports 4
- Data Rate (Max) 32
- Termination Method to PC Board Through Hole - Press-Fit
- PCB Mounting Style Through Hole Press-Fit
- Connector Mounting Type Board Mount
- Tail Length 2.05
- PCB Thickness (Recommended) 2.25
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Heat Sink Compatible No
- For Use With zSFP+ SMT Connector
- Packaging Method Tray
- EMI Containment Feature Type External Springs
- Included Lightpipe No