6-1761615-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 21
  • Height 16.65
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
5-1761613-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Vertical
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 15
  • Height 10.65
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
7-1761614-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 25
  • Height 20.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
5-1761617-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 296
  • Board-to-Board Configuration Vertical
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 296
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 15
  • Height 10.65
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • Packaging Method Tray
  • Packaging Quantity 20
6-1761615-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 25
  • Height 20.65
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
5-1761615-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 15
  • Height 10.65
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
6-1761612-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 20
  • Height 15.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
6-1761614-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 15
  • Height 10.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
6-1761614-3 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 18
  • Height 13.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
6-1761614-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 20
  • Height 15.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
6-1761616-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 296
  • Board-to-Board Configuration Vertical
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 296
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 15
  • Height 10.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 20
7-1761614-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Silver
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 30
  • Height 25.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
1-1761612-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 15
  • Height 10.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
1-1761612-2 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 17
  • Height 12.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
1-1761612-3 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 18
  • Height 13.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
1-1761612-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 20
  • Height 15.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
1-1761613-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Vertical
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 21
  • Height 16.65
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
1-1761613-5 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 104
  • Board-to-Board Configuration Vertical
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 104
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 25
  • Height 20.65
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • Packaging Method Tray
  • Packaging Quantity 30
1-1761614-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 15
  • Height 10.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 25
1-1761614-2 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 200
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 18
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 200
  • Voltage 48
  • Insulation Resistance 18
  • Busbar Mating Area Plating Thickness 500
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Configuration Dual Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 1
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Contact Layout Matrix
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.3
  • Housing Material Thermoplastic
  • Stack Height 17
  • Height 12.95
  • Operating Temperature Range 0 – 100
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tray
  • Packaging Quantity 25