6376118-6 DIMM Sockets
  • DRAM Type Single Data Rate (M3)
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.6
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Number of Positions 90
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Ejector Type Locking
  • Retention Post Location None
  • Module Key Type Offset Right
  • Ejector Location Left End Only
  • Ejector Material High Temperature Thermoplastic
  • Retention Post Material Stainless Steel
  • Ejector Material Color Silver
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Cam-In
  • Termination Post Length 2.6
  • Locating Posts Without
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Boardlock Material Stainless Steel
  • Centerline (Pitch) 1.27
  • Housing Color Gray
  • Housing Material Thermoplastic
  • Height above PC Board 30.4
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 80
5179601-1 DIMM Sockets
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Row-to-Row Spacing 5.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile High
  • Product Type Socket
  • Number of Positions 72
  • Module Orientation Right Angle
  • Number of Rows 2
  • Keying Short
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 3.3
  • Ejector Type Locking
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Ejector Material Stainless Steel
  • Solder Tail Contact Plating Material Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Style M3 (Mini Memory Module)
  • Contact Mating Area Plating Thickness .3
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Right Angle
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material LCP (Liquid Crystal Polymer)
  • Height above PC Board 7.8
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 35
6376118-1 DIMM Sockets
  • DRAM Type Single Data Rate (M3)
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.6
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Number of Positions 90
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Ejector Type Locking
  • Retention Post Location None
  • Module Key Type Offset Right
  • Ejector Location Left End Only
  • Ejector Material High Temperature Thermoplastic
  • Retention Post Material Stainless Steel
  • Ejector Material Color Silver
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Cam-In
  • Termination Post Length 2.6
  • Locating Posts Without
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Boardlock Material Stainless Steel
  • Centerline (Pitch) 1.27
  • Housing Color Natural
  • Housing Material Thermoplastic
  • Height above PC Board 30.4
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 80
5179707-1 SIMM Sockets
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Profile Standard
  • Center Post Without
  • Module Orientation Right Angle
  • Number of Positions 72
  • Number of Rows 1
  • Number of Keys 1
  • Center Key None
  • Ejector Type Locking
  • Retention Post Location None
  • Latch Plating Material Tin-Lead
  • Latch Material Copper Alloy
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Tin-Lead over Nickel
  • Contact Current Rating (Max) .3
  • Socket Style M3 (Mini Memory Module)
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Thickness 30
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
6376118-2 DIMM Sockets
  • DRAM Type Single Data Rate (M3)
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.6
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Number of Positions 90
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Ejector Type Locking
  • Retention Post Location None
  • Module Key Type Offset Right
  • Ejector Location Left End Only
  • Ejector Material High Temperature Thermoplastic
  • Retention Post Material Stainless Steel
  • Ejector Material Color Silver
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Cam-In
  • Termination Post Length 2.6
  • Locating Posts Without
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Boardlock Material Stainless Steel
  • Centerline (Pitch) 1.27
  • Housing Color Black
  • Housing Material Thermoplastic
  • Height above PC Board 30.4
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 80