1-5380758-0 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 4
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.03
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.65
  • Hole Size (Recommended) 2.26
  • Wire/Cable Size .518 – 1.31
  • Mating Pin Diameter Range .91 – 1.3
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 126
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-331677-6 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5331677-2 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5332070-3 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 1.27
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .653
  • Mating Pin Diameter Range .94 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050865-5 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050864-6 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050865-8 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire/Cable Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-331677-9 Discrete Sockets
  • Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
3-5331677-8 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .41
  • Mating Pin Diameter Range .66 – .74
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050864-1 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper