6-5330808-5 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
50863-4 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5331272-5 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .205 – .258
  • Mating Pin Diameter Range .56 – .64
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5-5330808-6 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-330808-8 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5331272-7 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .205 – .258
  • Mating Pin Diameter Range .56 – .64
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
1-5645956-1 Discrete Sockets
  • Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.67
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
5645946-2 Discrete Sockets
  • Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.67
  • Hole Size (Recommended) 1.07
  • Wire/Cable Size .102 – .205
  • Mating Pin Diameter Range .3 – .53
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Reel
  • Packaging Quantity 50000
  • Spring Material Beryllium Copper
50864 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire/Cable Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5-5330808-3 Discrete Sockets
  • Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
1-5332095-9 Discrete Sockets
  • Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.52
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
1-5645953-2 Discrete Sockets
  • Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant Yes
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.01
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .162 – .326
  • Mating Pin Diameter Range .51 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Reel
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
1-645955-1 Discrete Sockets
  • Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant Yes
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.67
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Reel
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
2-330808-7 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • Contact Spring Plating Thickness 2.54
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-331272-6 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .205 – .258
  • Mating Pin Diameter Range .56 – .64
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-332095-1 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.52
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5330808-7 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5331272-3 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire/Cable Size .162
  • Mating Pin Diameter Range .46 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-5332095-4 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.52
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
3-330808-8 Discrete Sockets
  • Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Socket Type Discrete
  • PCB Termination Method Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper