50935 Discrete Sockets
  • Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.27
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5-5330808-4 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant No
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 3
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire/Cable Size .0404 – .081
  • Mating Pin Diameter Range .25 – .33
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5645947-1 Discrete Sockets
  • Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sealant Yes
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.01
  • Hole Size (Recommended) 1.07
  • Wire/Cable Size .102 – .205
  • Mating Pin Diameter Range .38 – .53
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Power & Signal
  • Packaging Method Reel
  • Packaging Quantity 50000
  • Spring Material Beryllium Copper