1-1735438-3 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Center Post With
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Hold-Down Material Copper Alloy
  • Retention Post Location None
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Color Natural
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Gold Flash over Nickel
  • Contact Current Rating (Max) 1
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Socket Style Mini DIMM
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Hold-Down Plating Material Tin
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Hard Tray
1-1735438-1 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Center Post With
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Hold-Down Material Copper Alloy
  • Retention Post Location None
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Color Natural
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Gold Flash over Nickel
  • Contact Current Rating (Max) 1
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Socket Style Mini DIMM
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Hold-Down Plating Material Tin
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Hard Tray
1-1735438-2 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Center Post With
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Keying Reverse
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Hold-Down Material Copper Alloy
  • Retention Post Location None
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Color Natural
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Gold Flash over Nickel
  • Contact Current Rating (Max) 1
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 15
  • Socket Style Mini DIMM
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Hold-Down Plating Material Tin
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Hard Tray
1735438-1 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Center Post With
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Hold-Down Material Copper Alloy
  • Retention Post Location None
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Color Natural
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Gold Flash over Nickel
  • Contact Current Rating (Max) 1
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Socket Style Mini DIMM
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Hold-Down Plating Material Tin
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Hard Tray
1735438-2 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Center Post With
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Keying Reverse
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Hold-Down Material Copper Alloy
  • Retention Post Location None
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Color Natural
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Gold Flash over Nickel
  • Contact Current Rating (Max) 1
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Socket Style Mini DIMM
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Hold-Down Plating Material Tin
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Hard Tray
1735438-3 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Center Post With
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Hold-Down Material Copper Alloy
  • Retention Post Location None
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Color Natural
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Gold Flash over Nickel
  • Contact Current Rating (Max) 1
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Socket Style Mini DIMM
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Hold-Down Plating Material Tin
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Hard Tray
1735438-4 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Center Post With
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Hold-Down Material Copper Alloy
  • Retention Post Location None
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Color Natural
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Gold Flash over Nickel
  • Contact Current Rating (Max) 1
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Socket Style Mini DIMM
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Hold-Down Plating Material Tin
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Hard Tray